TLMI Corporation

When you are looking for quality and dependability, rely on TLMI as your wafer bumping partner. We use advanced electroplating techniques, offering gold, copper, indium, nickel, leaded and lead free solder bumping. In addition we provide pad redistribution, multilayer RDL, mask layout and procurement services. Outsourced processing contacts are available for backgrinding, dicing and pick & place. Our advanced plating technology allows for fine pitch bumping (under 100 micron) stacked up to 250 micron tall. TLMI, strategically located in Austin, TX, is dedicated to delivering the highest customer satisfaction and most advanced technology in end-to-end, turn key wafer flip chip fabrication services in North America. The focus of our Austin facility is on prototype development of all types of bumping requirements, initial production ramps, and specialty bumping of flip chip interconnect applications that require a high degree of engineering skill. TLMI can help with transferring your device to any high volume wafer bumping or pad redistribution company.