16 October 2026. Zeiss Semiconductor Manufacturing Technology (SMT) announced its entry into wafer inspection systems at SEMICON West 2026 in San Francisco. The company, which supplies lithography optics and photomask systems for chip fabrication, showcased two new products: Zeiss DUNE and Zeiss NLX.
Zeiss DUNE measures wafer topography and can correct it individually, addressing wafer bow in complex fabrication processes. Zeiss NLX, designed for 300-mm wafers, makes internal structures in modern chip packages visible without destroying them. Engineers can use it to inspect connections between stacked dies and detect potential defects early.
"Wafer flatness has become a huge issue," Raghu Nayak, head of U.S. sales for Zeiss SMT, told EE Times. "Zeiss DUNE helps flatten wafers and ensures overlay for next fabrication steps."
"These inspection systems will help engineers in wafer-by-wafer adjustments and thus boost precision, process control, and productivity in semiconductor fabrication," Nayak added.
SEMICON West 2026 was held on Oct. 13-15, 2026. The event covered the semiconductor manufacturing value chain, including lithography, photomasking, wafer inspection and materials.
Source: EE Times
The Department of Commerce's CHIPS Program Office has amended GlobalFoundries' existing award, reallocating up to $955m in incentives. GlobalFoundries will expand its capital investment in Malta, NY and Burlington, VT to $5bn.
GlobalFoundries has been selected as technology provider and operator for two new semiconductor fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding.
GlobalFoundries was selected as technology provider and operator for two new fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding. An initial investment of approximately $10 billion will accelerate construction of a new 300mm fab expected to come online in 2029.
