UMW-Series femtosecond laser micromachining workstations combine nearly 30 years of expertise with cutting-edge ultrafast micromachining capabilities. Designed for precision, flexibility, and ease of use, these systems feature customizable beam delivery, advanced machine vision, and a modern, intuitive interface. UMW is purpose-built for demanding drilling, cutting, and milling applications, featuring up to seven motion axes for effortless handling of complex geometries and precise ablation control. Powered by our highest-energy lasers, it accommodates large samples with ease and delivers the fastest throughput of any system in our workstation lineup. Click to learn more. UMW is engineered for high-precision applications, including micron-level sample sectioning for electron microscopy across the full sample depth. It's also available in a SEMI Certified model, ensuring compliance with industry standards. Click to learn more. UMW's adaptable multi-axis design makes it exceptionally well-suited for precision welding across a variety of setups. Its high-power laser ensures rapid processing speeds, meeting the throughput demands of high-volume sectors such as medical manufacturing. From welding fiber optics to sensors or protective windows for delicate components, to performing hermetic sealing of cells—UMW delivers outstanding performance. Click to learn more. UMW is the go-to solution for multi-faced and intricate 3D machining, offering up to seven motion axes for unmatched flexibility. Its advanced sample and beam manipulation controls enable precise, repeatable processing of complex geometries. UMW is also available in SEMI Certified variants, meeting stringent industry standards. Click to learn more.
SolaFab: Experience-Driven Innovation in Femtosecond Micromachining Backed by over 30 years of expertise in ultrashort pulse laser manufacturing and hundreds of successful real-world projects, SolaFab is redefining femtosecond micromachining. Precision, Performance, and Seamless Integration Purpose-built for accuracy and reliability, SolaFab delivers a fully integrated solution —combining laser, optics, mechanics, and software into a streamlined, ready-to-use system. Compact, Powerful, and Cost-Effective Designed to expand accessibility in manufacturing and R&D, SolaFab brings advanced femtosecond laser micromachining to more applications than ever before—all in a compact, high-performance package. Unlock the future of precision micromachining with SolaFab-Series. Features A fully integrated femtosecond micromachining system, designed for precision, efficiency, and ease of use. - Solas-Series Laser Source – High-performance femtosecond laser for ultrafast material processing. - Multi-Axis Positioning System – Precise motion control for complex machining tasks. - High-Dynamic Response Beam Steering – Rapid and accurate beam manipulation for enhanced processing speed. - Optimized Beam Delivery System – Engineered for maximum efficiency and precision in material interaction. - Customizable Processing Parameters – User-selectable settings to match specific application needs. - Class I Enclosure – Safety-compliant housing for operator protection. - Integrated On-Axis Vision System – Real-time monitoring for precision alignment and machining verification. - Optional Digital and Analog I/O – Expanded control capabilities for seamless integration into workflows. - Engineered Composite Machine Base – Rigid and stable foundation to minimize vibration and enhance accuracy. - Compact Desktop-Sized Design – Space-saving form factor for laboratory and production environments. Specifications Positioning System Stage System (X, Y): 150 mm x 150 mm Beam scan head Operational window is objective dependent Dynamics Z-axis: 100 mm Vision System Lighting: On-axis LED illumintated vision system Functions: Autofocus, Alignment, Autotomatic part rotation, Feature recognition 1 Laser Solas integrated femtosecond fiber laser Enclosure Class 1 laser enclosure - Some features require optional packages. Applications SolaFab is designed for high-precision femtosecond laser micromachining, enabling advanced material processing across various industries. - Precision Micro-Hole Drilling – Create ultra-fine, high-accuracy holes in delicate materials. - Precision Micro-Milling – Achieve intricate surface textures and complex geometries with femtosecond accuracy. - Thin-Film Ablation – Remove material layers precisely without thermal damage. - Microcutting – Deliver clean, burr-free cuts with minimal heat impact. - Micro/Nano Patterning – Fabricate high-resolution structures for electronics, optics, and biotechnology. - Electron Microscopy Sample Preparation – Enhance sample quality with ultra-precise material removal. - Controlled Defect Generation – Introduce precise modifications for research and material testing. - Micro-Marking & Identification – Apply permanent, high-contrast markings on various substrates.
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With over 30 years of expertise in ultrashort-pulse laser manufacturing and hundreds of real-world applications, we’ve developed the SolaFab II-Series —a next-generation line of femtosecond micromachining workstations. A Complete, Integrated Micromachining Solution SolaFab II provides everything you need for femtosecond laser micromachining, leveraging our deep experience in lasers, optics, mechanics, and software to create powerful, reliable manufacturing solutions. Performance & Reliability for Advanced Manufacturing Built for production environments, the SolaFab II-Series delivers exceptional precision, stability, and efficiency, expanding the accessibility of femtosecond laser machining into new frontiers of manufacturing and R&D. Discover the future of femtosecond micromachining with SolaFab II. Solafab II is built on femtosecond laser micromachining technology, which utilizes ultrafast laser pulses to achieve precise material processing with minimal heat impact. Here’s a breakdown of the key technologies involved: - Femtosecond Laser Source: The system generates laser pulses lasting only a few quadrillionths of a second (femtoseconds). These ultrashort pulses enable cold ablation, where material is removed without significant thermal effects, preventing unwanted melting or damage. - Beam Scanning & Control: Solafab II incorporates advanced beam scanning capabilities that allow for highly precise and adaptable machining. This can include galvanometer-based scanning for rapid beam movement or programmable optical elements for beam shaping. - Enhanced Material Interaction: The system’s more powerful laser and increased energy density improve processing speeds and expand the range of materials it can handle. It supports everything from delicate thin films to bulk materials up to 1 mm thick. - Work Area & Automation: With a larger work area than its predecessor, Solafab II accommodates more complex machining tasks and integrates automation features for improved efficiency—ideal for both R&D and mid-volume production environments. Positioning System Stage System (X, Y): 200 mm x 200 mm Beam scan head Operating window: 40mm x 40mm Dynamics Z-axis: 100 mm max travel Vision System Lighting: On-axis LED illumintated vision system, Secondary off-axis optional Functions: Autofocus, Alignment, Autotomatic part rotation, Feature recognition 1 Laser Solas- II integrated femtosecond fiber laser Enclosure Class 1 laser enclosure SolaFab II leverages femtosecond laser technology to enable high-precision micromachining across multiple industries. - Micro-Hole Drilling – Achieve ultra-fine, high-accuracy perforations in a variety of materials. - Micro-Milling – Create intricate surface textures and complex geometries with sub-micron precision. - Thin-Film Ablation – Remove material layers cleanly without heat-induced damage. - Microcutting – Deliver crisp, burr-free cuts with superior edge quality. - Micro/Nano Patterning – Fabricate high-resolution structures for electronics, optics, and biomedical applications. - Electron Microscopy Sample Preparation – Enhance sample quality with precise material removal techniques. - Controlled Defect Generation – Introduce engineered modifications for research and material testing. - Micro-Marking & Identification – Apply permanent, high-contrast markings with unparalleled accuracy.
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Next-Generation Femtosecond Micromachining Workstations With over 30 years of expertise in ultrashort pulse lasers and hundreds of real-world applications, we’ve perfected the art of precision micromachining. Our latest UMW-Series workstations bring together cutting-edge technology and decades of processing experience to deliver unmatched performance. All-in-One Micromachining Solution The UMW-Series provides everything you need to start micromachining with ultrashort-pulsed lasers. Designed from years of hands-on experience, these workstations integrate the ideal combination of components, performance parameters, and software —ensuring precision, efficiency, and reliability. Advanced Features & Seamless Control - Customizable Beam Delivery – Ample space for flexible beam manipulation and integration. - Precision Machine Vision & Inspection – A sophisticated system for real-time monitoring and accuracy. - Intuitive Software Interface – Modern graphical design with seamless control of all system components. - CAD File Integration – Direct import of CAD, Gerber, and NC Drill files, along with built-in drawing tools. - Smart Editing & Hatch Options – Manipulate imported CAD files within the user interface and apply various hatch patterns to closed regions. UMW-Series: Fully Integrated Precision Micromachining Workstations Engineered for unmatched precision and control, the UMW-Series offers a comprehensive suite of cutting-edge features to optimize ultrashort-pulse laser micromachining. Key Features - Proven Laser Technology – Choose from CPA-Series or IMPULSE Family, renowned for reliability and performance. - Advanced Motion Control – Multi-axis CNC positioning system ensures accuracy in every process. - Optimized Beam Delivery – Designed for maximum efficiency and precision. - Intelligent Processing Parameters – Computer-controlled selection for seamless operation. - Class I Enclosure – Provides a safe and compliant working environment. - Integrated Machine Vision & Inspection – On-axis system for real-time monitoring and enhanced quality control. - Customizable Pulse Control – “On-demand” pulse selection, from 1 to 64,000, at user-defined repetition rates. - Versatile I/O Options – Optional digital and analog input/output configurations. - Precision Stability – Granite base mounted on pneumatic vibration isolators for ultra-stable processing. - Flexible User Area – Space allocated for beam manipulation and diagnostics. - Industry-Compliant Certification – Meets NFPA, IEC 60825-1, SEMI S2, SEMI S8, and SEMI S14 standards (model specific). Elevate your micromachining capabilities with UMW-Series technology. Positioning System Stage Travel (X, Y): Up to 300 mm x 300 mm Stage Performance (X, Y): Application specific Beam scan head Optional multi-axis beam scanner Dynamics Z-axis: up to 100 mm max travel Configurations: Fully configurable options up to 7 axis available Vision System Lighting: On-axis LED illumintated vision system, Secondary off-axis and Ring lighting optional Functions: Pattern/Feature recognition, Edge location, Part measurement, Autofocus, Alignment, Autotomatic part rotation Laser Impulse Family or CPA Series laser Enclosure Class 1 laser enclosure
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Solafab II enhances the original Solafab with a significantly more powerful laser, an expanded work area, faster material removal rates, and advanced beam scanning capabilities. Designed to handle materials up to 1 mm thick, it seamlessly supports applications ranging from research and development to mid-volume production. Solafab II is engineered for precision machining of materials up to 1 mm thick. It features a comprehensive suite of advanced machining and vision capabilities, enabling high-performance 2.5D and 3D cutting, drilling, and milling for complex fabrication tasks. Click to learn more. Solafab II is engineered for high-precision machining of materials up to 1 mm thick. Equipped with advanced machining and vision technologies, it excels at producing custom TEM sample grids, FIB lift-out grids, and rapid sample sectioning for electron microscopy analysis. Click to learn more. Solafab II is fully equipped for advanced micro-welding tasks, capable of joining transparent materials to both similar and dissimilar substrates using laser energy to create bonds as strong as the bulk material itself. Its applications span aerospace, medical devices, and quantum computing. Click to learn more. Solafab II builds upon the microstructuring capabilities of the original Solafab by delivering enhanced speed, deeper ablation capability, and support for more advanced patterning techniques—making it a powerful upgrade for precision surface engineering. Click to learn more. Solafab II is engineered for high-precision machining of materials up to 1 mm thick. With its advanced machining and vision technologies, it enables layer-by-layer removal with minimal damage—revealing internal structures for accurate 3D specimen reconstruction. Click to learn more.
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