Maximum information from every scan and any sample at the nanoscale Tescan CLARA ™ (UHR-SEM) Ultra-High-Resolution SEM That Reveals More Information from Every Scan Extract more information from challenging materials at low landing energies. CLARA™ combines field‑free ultra‑high‑resolution SEM imaging, advanced secondary electron (SE) and backscattered electron (BSE) detection, and guided automation to help you move from sample navigation to confident insight faster. Designed for nanoscale characterization across diverse materials and workflows, CLARA™ enables you to reveal fine surface structures, material differences, and near-surface features from a single acquisition while maintaining the flexibility required for advanced analytical techniques. CLARA™ gives researchers the resolution, contrast control, and guided operation needed to explore surface detail, material differences, and near‑surface features with confidence. Built on Tescan's BrightBeam™ field-free SEM column technology and operated through Tescan's Essence™ software, CLARA™ supports efficient work across diverse samples, shared instruments, and mixed experience levels. It helps you capture meaningful information with less compromise, less setup, and fewer repeated measurements. - True ultra-high-resolution field-free imaging at low keV Delivers stable nanoscale detail across different samples, including charging, sensitive, and magnetic samples. - Simultaneous UHR SE and BSE imaging with advanced contrast control Combines parallel acquisition of SE and BSE signals with energy-filtered and angle-selective BSE contrast for deeper material insight in a single scan. - Effortless switching between imaging conditions and seamless navigation Powered by In-Flight Beam Tracing® automation for rapid beam optimization, combined with Wide Field Optics® for seamless navigation from macro to nano. - Advanced analytical workflows with open platform flexibility Supports integration of multiple analytical modalities (EDS, EBSD, Raman, etc.) and customizable workflows via custom automation and Python-based scripting. - MultiVac low-vacuum imaging with water vapor and easy switching Improves signal quality and enables stable imaging and analysis of charging and beam-sensitive samples with an uncompromised view field. Where Tescan CLARA™Makes the Difference Reveal More Information from Every Scan Modern nanoscale characterization requires more than resolution alone. CLARA™ is designed to help researchers extract multiple complementary contrasts from the same region of interest, revealing information that conventional imaging workflows can miss. Through simultaneous ultra-high-resolution secondary electron (SE) and backscattered electron (BSE) imaging, combined with energy-filtered and angle-selective BSE detection, CLARA™ enables researchers to: - Reveal fine surface topography - Differentiate material phases and composition - Detect near-surface contamination and buried structures - Visualize orientation-sensitive features - Reduce rescans and repeated measurements - Move more quickly from imaging to interpretation Unlike conventional UHR SEM workflows that require repeated acquisitions or detector switching, CLARA™ combines multiple complementary signals within a single platform and workflow. True Multimodal Contrast at the Nanoscale The redesigned MultiDetector™ and Axial detector enable flexible contrast selection for both surface-sensitive and material-sensitive imaging. Energy-filtered BSE imaging helps reveal near-surface material differences and contamination that may remain hidden in conventional BSE workflows. Angular contrast selection further enhances the interpretation of topographic and compositional variation. The result is richer nanoscale characterization from every acquisition. Ultra-High-Resolution Imaging at Low Landing Energies Capture stable ultra-high-resolution images while preserving sensitive materials closer to their native state. Built on Tescan BrightBeam™ field-free SEM column technology, CLARA™ delivers stable, low-keV imaging performance across challenging samples, including nonconductive materials, magnetic samples, beam-sensitive structures, porous materials, and highly topographic specimens. Low-landing-energy imaging helps reduce charging effects and minimize beam damage while preserving nanoscale detail. The field-free optical design also enables reliable imaging of magnetic samples without the limitations associated with immersion lens systems. Reduce Sample Preparation Researchers often need to balance image quality against preparation complexity. CLARA™ supports high-quality imaging of challenging samples with reduced reliance on conductive coating or extensive preparation workflows, helping preserve sample integrity while accelerating analysis. Simultaneous UHR SE and BSE Imaging Acquire complementary topographic and material information simultaneously. CLARA™ combines the Axial detector and MultiDetector™ to enable parallel ultra-high-resolution SE and BSE imaging from the same region of interest. This enables researchers to compare surface, topographical, and material contrast directly, reduce rescanning and repositioning, maintain ROI consistency, and accelerate interpretation and decision-making. The Axial detector delivers highly surface-sensitive imaging for fine nanoscale detail, while the MultiDetector™ enables flexible BSE signal filtering and contrast optimization. Advanced BSE Filtering and Contrast Selection The MultiDetector™ supports energy filtering above 4 keV, enabling researchers to optimize material-sensitive contrast across a wide range of applications. Researchers can tailor contrast conditions to highlight surface-sensitive material contrast, pure compositional contrast, orientation-sensitive contrast, near-surface contamination, and thin surface layers and buried features. This flexibility helps reveal information that would otherwise require multiple workflows or remain hidden entirely. Faster Time-to-Data with Automation Move from navigation to optimized imaging conditions faster with less manual adjustment. Tescan Essence™ software combines guided workflows with live In-Flight™ automation technologies to simplify operation across experience levels. Integrated automation tools include continuous real-time beam optimization, autofocus, autostigmation, live automatic brightness and contrast adjustment, automated beam alignment, and workflow support. These tools help users reach stable imaging conditions faster, reduce operator dependency, shorten onboarding time, improve repeatability across shared labs, and maintain productivity across diverse workflows. Seamless Navigation from Macro to Nano Wide Field Optics® and Continual Wide Field™ support fast, distortion-free navigation across large or complex samples. Researchers can move efficiently from overview imaging to ultra-high-resolution acquisition while maintaining the region of interest throughout the workflow. Even in low vacuum mode, the scanning pivot in the aperture plane maintains a broad field of view, similar to high vacuum, no matter the inserted aperture. This facilitates quicker navigation, smoother workflows, and more efficient EDS analysis by minimizing the need for re-navigation and additional mapping. Overview mode simplifies analysis of large, topographic, and grainy specimens, even at tilt, with precise navigation, reliable measurements, across large field of view. This is especially valuable for: - Failure analysis - Battery materials research - Large topographic samples - Multi-user laboratory environments - Correlative imaging workflows Built for Shared Research Laboratories Modern research facilities require instruments that combine high-end performance with operational flexibility. CLARA™ is designed for collaborative laboratories handling diverse samples, analytical techniques, and operator experience levels. Automated alignment, the live Essence™ 3D Collision Model, easy switching between high- and low-vacuum modes, and MultiVac operation with nitrogen and water vapor help researchers work efficiently across changing imaging conditions while protecting both the instrument and the sample. Together, these workflow capabilities help laboratories support a broader range of applications, reduce training burden, improve workflow consistency across users, and increase throughput in shared research environments. Advanced Analytical Workflows CLARA™ combines nanoscale imaging performance with the flexibility required for advanced analytical characterization. The platform supports advanced analytical workflows, including EDS, EBSD, Raman, cathodoluminescence (CL), WDS, EBL, 4D-STEM, and correlative imaging techniques, enabling researchers to combine nanoscale imaging with complementary chemical, structural, and materials characterization methods within a single workflow. Wide Field Optics®, In-Flight Beam Tracing ®, and stable low-keV performance support efficient transitions between imaging and analytical conditions without interrupting the workflow. Flexible Platform for Future Research Needs CLARA™ is designed as a long-lasting nanoscale characterization platform. A large chamber, flexible detector configuration, broad analytical compatibility, and upgrade-ready architecture
High-Throughput, Multi-Scale Dynamic micro-CT for Imaging in Real-Time Tescan UniTOM® XL, and its smaller version, CoreTOM® are designed for research environments where temporal resolution, imaging flexibility, and experimental throughput matter. A high-power X-ray source, fast large-field detector, and automated multi-sample workflows work together to keep your lab focused on insight, not setup. This results in faster scans, richer data, and true 4D visualization of materials in action. - High temporal resolution for dynamic, in situ, and continuous 3D imaging - Large-sample and multi-scale capability with a spacious scanning envelope - Optimized throughput and reproducibility through automated batch scanning - Seamless workflow control with Acquila™ and Panthera™ software integration WHERE TESCAN UNITOM® XL MAKES THE DIFFERENCE High Temporal Resolution without Compromise: Capture real-time sample changes with continuous 4D scanning at temporal resolutions under three seconds, without sacrificing image quality or stability. Optimized Throughput for Shared Facilities: Maximize productivity through automated batch scanning and rapid acquisition workflows. Tescan UniTOM® XL supports multiple users and high daily sample volumes with consistent results. Flexible Imaging for Every Sample: From centimeter-scale components to fine structural details, the versatile sample stage and ten motorized axes accommodate a broad range of sample sizes and orientations. True Multi-Scale Imaging: Volume of Interest Scanning (VOIS) enables detailed high-resolution imaging within larger samples — providing both context and clarity in a single workflow. In Situ and Dynamic Experiment Capability: Perform uninterrupted insitu studies with slip-ring technology and optional external connection interfaces, supporting mechanical, thermal, or chemical testing during live scanning. Seamless Workflow Integration: Acquila™ and Panthera™ software environments manage acquisition, reconstruction, and visualization — delivering complete experimental control from setup to analysis. Reliable, Non-Destructive Analysis: Generate repeatable, quantitative 3D and 4D datasets without altering the sample, ensuring structural integrity for ongoing or correlative studies. Tescan UniTOM® XL in Materials Science — High-resolution, non-destructive imaging for structural and dynamic analysis - Non-destructive 3D characterization of pores, cracks, inclusions, fibers, interfaces, and internal defects - Multi-scale imaging connects whole-sample context with micron-scale structural detail - In situ and continuous 4D imaging track deformation, cracking, phase changes, and failure mechanisms over time Tescan UniTOM® XL supports material research from routine 3D characterization to advanced time-resolved studies. Researchers can quantify the internal structure of intact materials in 3D, including morphology, porosity, defects, and interfaces, then extend the same workflow into 4D when they need to observe how those structures evolve under load, heat, or chemical exposure. The result is reproducible, non-destructive insight into both material architecture and performance over time. Tescan UniTOM® XL in Semiconductors — High-resolution 3D and 4D micro-CT, from packages to complete electronic assemblies - Non-destructive 3D inspection of complete devices, from small consumer electronics to larger assemblies such as laptops - Large field of view preserves full-device context while enabling analysis of internal components, connections, batteries, PCBs, and housings - High image quality at practical scan times supports failure analysis, design validation, and quality investigation without disassembly - 4D capability can support selected mechanical or thermal reliability studies where internal changes need to be followed under controlled conditions Tescan UniTOM® XL enables researchers and engineers to inspect consumer electronics and electronic assemblies in 3D without opening, cutting, or disassembling the device. Its large field of view makes it possible to image anything from compact devices and individual modules to larger assemblies such as laptops, while preserving the spatial relationship between components. Users can investigate batteries, printed circuit boards, connectors, housings, adhesives, interfaces, voids, cracks, assembly defects, and other internal features that influence reliability and performance. For selected reliability workflows, Tescan UniTOM® XL can also extend from static 3D inspection to 4D imaging, helping teams observe internal changes during controlled mechanical or thermal testing. Tescan UniTOM® XL in Batteries — High-resolution 3D and 4D micro-CT for battery structure, operation, and degradation - Non-destructive 3D analysis of battery cells, electrodes, and solid-state interfaces - Multi-scale imaging captures structure from electrode level to full-cell context - Operando 4D imaging tracks swelling, cracking, electrolyte movement, and degradation during cycling or stress testing Tescan UniTOM® XL supports battery research from static 3D characterization to in-situ 4D experiments, enabling time-resolved micro-CT imaging of batteries under realistic operating conditions. Fast acquisition and continuous rotation support uninterrupted observation during charge–discharge cycling or thermal stress. This enables clearer insight into electrode design, cycle-life behavior, and safety performance. Tescan UniTOM® XL in Life Science — Versatile 3D micro-CT for biological, clinical, forensic, and natural history research - Non-destructive 3D imaging of biological specimens, tissues, and natural history collections - Large field of view supports a wide range of sample sizes while preserving anatomical and morphological context - High image quality at practical scan times for soft tissue, stained samples, mineralized structures, fossils, and dense materials - 4D capability supports biomechanics studies where deformation, motion, or mechanical response needs to be followed over time Tescan UniTOM® XL enables life science researchers to visualize internal structures in 3D across an exceptionally broad range of specimen types and sizes. From delicate biological samples and human tissues to larger developmental, clinical, forensic, and natural history specimens, the system provides the flexiblity needed for multi-user research environments. Its large field of view and strong image quality help preserve whole-sample context while revealing fine internal detail, supporting non-destructive investigation of valuable, rare, or difficult-to-prepare samples. In addition, in situ connectivity and 4D imaging can support time-resolved imaging to connect morphology with mechanical behavior. Tescan UniTOM® XL in Geoscience — High-resolution characterization of geological samples, from 3D pore networks to 4D fluid flow - Non-destructive 3D characterization of pore networks, fractures, grains, mineral phases, and core heterogeneity - Large scanning envelope accommodates full-size rock cores up to 1 m tall - In situ and 4D imaging capture fluid flow, trapping, fracture dynamics, and mineral–fluid interactions over time Tescan UniTOM® XL, and its smaller version, Tescan CoreTOM® support geoscience workflows from static 3D rock characterization to dynamic 4D experiments. Researchers can quantify pore networks, fractures, mineral distributions, and core-scale heterogeneity in 3D, then observe how these structures affect fluid migration, trapping, and deformation under relevant experimental conditions. The systems’ large sample capacity and dynamic imaging performance help connect pore-scale measurements with reservoir-scale models. Tescan UniTOM XL in Materials Science — High-resolution, non-destructive imaging for structural and dynamic analysis - Multi-scale micro-CT enables visualization of structures from millimeters down to microns - Continuous 4D imaging reveals deformation, cracking, or phase changes in real time - Insitu interfaces allow live observation under thermal, mechanical, or chemical stimuli Tescan UniTOM XL supports material research where understanding internal structure and evolution over time is essential. Its combination of high temporal and spatial resolution enables researchers to quantify changes such as fracture propagation, composite failure, and pore evolution. The result is a reproducible, non-destructive insight into material performance and durability. Tescan UniTOM XL in Energy and Battery Research — Dynamic micro-CT for studying material behavior during operation - Real-time visualization of electrode swelling, and electrolyte movement - Non-destructive analysis of battery cells, electrodes, and solid-state interfaces - Multi-scale imaging captures microstructural evolution from particle to full cell TESCAN UniTOM XL enables time-resolved micro-CT imaging of batteries under realistic operating conditions. Fast acquisition and continuous rotation support uninterrupted observation during charge–discharge cycling or thermal stress. This enables clearer insight into electrode design, cycle-life behavior, and safety performance. Tescan UniTOM XL and CoreTOM in Geoscience and Porous Media — In situ observation of fluid flow and structural changes in geological samples - High temporal resolution captures fluid flow, trapping, and fracture dynamics - Large scanning envelope accommodates full size rock cores up to 1m tall - Non-destructive imaging preserves sample integrity for repeated testing Tescan UniTOM XL, and its smaller version, CoreTOM enable geoscientists to observe pore-scale processes in real time. Researchers can follow fluid migration pathways and mineral–fluid interactions in reservoir rocks, extending to CO₂ and H₂ storage scenarios. The system’s large sample capacity and dynamic imaging performance make it ideal for correlating laboratory experiments with reservoir-scale models. TESCAN UniTOM XL in Industrial and Manufacturing Research — High-throughput 3D and 4D imaging for process optimization and quality assurance - Non-destructive inspection of components and assemblies for defect detection - Batch scanning and automated reconstruction for multi-user laboratory environments - Multi-scale imaging supporting analysis from part-level structure to micro-defect formation TESCAN UniTOM XL delivers fast, repeatable imaging that supports process validation and failure analysis in industrial R&D and quality control. Its combination of throughput, resolution, and large-sample handling reduces inspection time while maintaining quantitative accuracy, ensuring reliable evaluation of manufactured materials and components. Tescan Acquila™ and Panthera™ Software Ecosystem — AUTOMATION THAT STREAMLINES 4D IMAGING WORKFLOWS Tescan UniTOM® XL integrates seamlessly with the Acquila™ and Panthera™ software environment, providing coordinated control of acquisition, reconstruction, and visualization. Dynamic CT experiments may run without interruption, with reconstruction and analysis carried out alongside acquisition to maintain workflow efficiency, ensuring uninterrupted operation and maximum throughput. The software suite offers automated workflow management, live monitoring, and real-time visualization in an intuitive interface that reduces setup time and ensures reproducible results. For dynamic or in situ studies, Acquila™ and Panthera™ synchronize imaging with external rigs and detectors to maintain full experimental control throughout the 4D imaging process.
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Non-destructive elemental information from any point inside a sample Tescan Spectral CT is designed for laboratories that need non-destructive 3D elemental insight alongside structural imaging. As an add-on to the Tescan UniTOM® XL, it uses full-spectrum, multi-energy acquisition with a dedicated secondary spectral detector to capture elemental signatures across the sample. With Tescan Spectral Suite™ and Acquila™ software working together, users can target regions of interest, reconstruct spectra, and correlate elemental with structural information in one workflow. This delivers clear material contrast and reliable elemental identification in every scan. - Non-destructive spectral micro-CT for 3D elemental information at any point inside the sample - TrueContrast™ multi-energy imaging to differentiate similar-density materials conventional CT cannot - Material identification using k-edge detection for absolute elemental identification without prior knowledge - Material identification using effective atomic number (Z-eff) and density extraction - Spectral Suite™+ Acquila™ integration for VOI targeting, spectral reconstruction, and analysis Full-Spectrum Imaging: Capture the entire X-ray spectrum during every scan to reveal both structural and elemental information in one dataset—no additional instruments or destructive preparation required. True Multi-Energy Contrast: Differentiate polymers, metals, or biological tissues with TrueContrast™ multi-energy imaging, delivering clarity where conventional micro-CT reaches its limits. K-Edge Element Detection: Identify and map precious metals and elements with absolute certainty using K-edge detection, enabling confident analysis of complex or unknown materials. Non-Destructive compositional Insight: Visualize internal composition and extract material density without cutting or altering samples, preserving integrity for further testing or archival studies. Integrated Spectral Suite™: Control acquisition, reconstruction, and spectral analysis through Spectral Suite™ software, fully synchronized with Acquila™ micro-CT control for streamlined workflows. Versatile Multi-Disciplinary Applications: From mineral cores to polymer composites and biological specimens, SPECTRAL CT expands UniTOM® XL performance into new domains of 3D elemental and structural research.
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Femtosecond Laser for High-Precision Semiconductor Sample Prep Tescan FemtoChisel™gives you nanometer-level precision and high-throughput intelligent laser processing for semiconductor research and failure analysis. It delivers pristine surfaces while significantly reducing the need for subsequent FIB polishing. Accelerate turnaround in device analysis and failure investigation for current and next-generation semiconductor materials. Achieve Pristine Laser Surfaces for Faster Semiconductor Analysis Tescan FemtoChisel™ is a femtosecond laser micro and nano machining system for sample preparation, micro and nano fabrication, failure analysis, and surface modification. Designed for semiconductor, glass processing, materials research, and biomedical device manufacturing workflows, it helps users access buried regions of interest, prepare clean surfaces, and accelerate analysis. Key benefits - Intelligent Multi-Gas Processing - Laser Protective Layer - Multi degrees of freedom stage with tilt and wafer-level rotation - Correlative Machine Vision & Targeting - Software-Selectable Laser Wavelength - Real-time surface and ablation monitoring with material adaptability
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Analytical STEM with integrated beam precession for enhanced 4D-STEM and 3D-ED structural studies Tescan TENSOR™enables fast and intuitive sample navigation and identification of regions of interest with their st Discover Tescan’s Nanoscale Insights with Tescan TENSOR™ Analytical STEM Assess the morphology, composition, and structure of analyzed samples with clarity, speed, and confidence to gain insights into their physical properties and function. Tescan’s analytical STEM solutions provide the necessary tools needed for advanced materials research, semiconductor analysis, and detailed nanoscale characterization, down to the atomic level. With fully integrated precession-assisted diffraction, and synchronized 4D-STEM and EDS workflows, you get immediately meaningful results and actionable insights with practical usability—whether you need to assess sample crystallinity, identify the distribution of different phases, validate strain engineering, or support process development and failure analysis.
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