The photoresists known as a photosensitive material, initiate a chemical reaction in the light. It is a chemical that plays an essential role in photolithography, a technology that is involved in the manufacture of semiconductor devices. In the semiconductor manufacturing, the exposure process that a photoengraving technique is applied to reduce and transfer the design drawn on the original plate (photomask) onto the silicon chip. To create power-saving, high-performance semiconductors, the circuits that are to be transferred need to be rendered smaller. Our photoresists are evolving from one day to the next in order to satisfy this requirement.
Negative tone photo patterable permanent film with high resolution and high adhesion, enabling the formation of high aspect ratio patterns for MEMS (Dry film and liqud type). Pattern & Adhesive in One Material.
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PFAS-Free, Environmentally Friendly Porous Polyimide Film Polyimide porous membranes have high heat resistance, low thermal expansion, and excellent dimensional stability, making them suitable for use in substrates and other applications. Taking advantage of their various favorable properties including high air permeability, porous membranes can also be used in applications such as waterproof breathable membranes. In addition, they do not use organic fluorine compounds, making them suitable as an alternatives to PFAS or PTFE. Features - Open cell structure with spherical pores - Consistent and uniform pore size - High porosity ⇒ high permeability, low dielectric constant - Low dielectric constant ⇒ Improved insulation and signal transmission Unique and Uniform Microstructure Intended Use Case - Various Separation Membranes (Lib Separator, etc.) - Low-Dielectric Substrate Material - Sound-Proof/Sound-Absorbing Materials - Heat Resistant/Insulating Materials Membrane Properties Item Unit μm Pore nm Pore Porosity % 70 70 Gurley sec/100cc 8〜10 200〜300 Strength MPa 25〜35 25〜40 Elongation % 20〜45 25〜40 Thermal decomposition ℃ 571 571 Dielectric 1 GHz - - 1.495 10 GHz - 1.461
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