By Expertech
Custom new and remanufactured thermal processing solutions and diffusion/LPCVD furnaces for semiconductors, MEMS, and R&D.
CTR compact diffusion furnaces offer powerful automated technology in a tiny footprint. For atmospheric and LPCVD processes, CTR models provide an ideal solution for pilot lines, low-volume production facilities, R&D operations, government sites, and academic institutions. With capabilities surpassing tabletop or laboratory furnace systems, the fully automated, recipe-driven CTR systems deliver film quality and process uniformity to rival full-size furnace equipment. Expertech's compact diffusion furnaces can process up to 200 mm round, 156 mm square substrates, or irregularly shaped parts with the same process capability as full-size platforms. CTR systems provide world-class process performance, featuring full recipe control and storage via a host PC supervisor, with high-technology data logging and graphic capabilities. Available with manual or fully automated loading systems, CTR systems offer several benefits: - Exceptionally Reliable & Fully Automated Technology - High-Performance Heating Elements - Atmospheric & LPCVD Configurations - Full Suite of Safety Interlocks - Integrated Control System with GUI for Interfacing with Multiple Tools - Smallest Footprint in Equipment Class with a Compact Design - Stackable Design Accommodating 4 CTR-125, 4 CTR-150, 3 CTR-200, and variable in CTR-300 - Features Process Controller Options - Controlled Rate of Wafer Load and Unload with Optional Recipe Controlled Loading Mechanism - Low-Cost of Ownership This system has capability far beyond the tabletop or laboratory diffusion furnaces of the past. Fully automated and recipe driven the results rival the uniformity and film quality of full size production systems. CTR systems offer high-quality production performance in small-footprint furnace technology. These compact diffusion furnaces are designed for a variety of applications, with exceptional capabilities for atmospheric processes, LPCVD, and solar cell production operations. Atmospheric Processes - Annealing - Thermal Oxidation - Diffusion - Drive/Anneal LPCVD Processes - PolySilicon/Amorphous Silicon - In-Situ Doped (ISD) - PolySiGE - Silicon Nitride - Low-Temperature Oxide - High-Temperature Oxide - Liquid Source Oxides - Vacuum Anneals Solar Cell Processing - Doping - Drive-In - Anneals - Silicon Nitride With additional design options, compact diffusion furnaces can be engineered to your needs. Customizations available to CTR systems include: - Can be configured with manual or automatic loading - Choose a Chronos-II or Mypro-II process controller - Selection of advanced supervisor systems - Design with high-temperature processing
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The CTR-200 system can process substrates with a diameter of up to 200 mm in round configurations and 156 mm in square configurations. It is designed with a tube featuring a maximum diameter of 300 mm and can accept smaller diameter process tubes for optimal processing of smaller substrates. CTR-200 models can be configured with up to six gas loops with dimensions of 35" W by 24" H by 80" D.
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Designed to process substrates with a maximum diameter of 150 mm, the CTR-150 features a tube of up to 235 mm in diameter. It can be configured with up to six gas loops with dimensions of 34.7" W by 21.1" H by 80" D and can accept smaller diameter process tubes for optimal processing of smaller substrates.
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Vertical thermal reactors from Expertech offer production-proven semiconductor diffusion processes. Providing a fully automated diffusion furnace solution with superior uniformity, the VTR7000PLUS has demonstrated world-class performance. VTR systems feature a unique dual-boat design for maximum operation and utilize premium components for reduced contamination in recipe-driven loading and processing technology. The VTR7000PLUS is a fully automated diffusion furnace that offers proven production superiority. Its design can achieve a higher throughput per tube using a dual-boat design, where one boat is in process while the other loads or reloads. Other high-quality features of Expertech's vertical diffusion furnaces include the following: - Features a ULPA-filtered Class 1 loading area and electropolished stainless steel surfaces for superior particle control - Uses a small-volume, ultraclean technology gas panel that is manufactured, tested, and capped in a cleanroom for fewer in-film defects - Easier and faster process tube maintenance through a mechanized tube removal system - Using a double-walled process tube to eliminate film particle formation near the loading door for advanced particle control in LPCVD films - Safety interlocks to protect personnel and equipment - Easy-to-learn operator interface with optional cell supervisor workstations for central monitoring and recipe control for a bank of up to 8 VTR systems Engineered with design enhancements for improved maintainability, high reliability, reduced contamination, and the smallest footprint in the industry, the VTR provides valuable cost savings through: - Low cost per wafer processed - Low cost to maintain - Low capital and installation cost VTR Reactor Performance - Flush mounted – no cleanroom projection - Width: 37 inches (95 cm) - Depth: 62 inches (1.57 m) - Height: 78 inches (1.98 m) in cleanroom wall - Height: 9 feet 8 inches (2.95 m) in service area - Service requirement: 4 feet (1.2 m) in rear - Up to 58 steps per recipe - Optional Host Supervisor system - Floppy drive / USB Port - SEMI Standard cassette type - Typical diffusion/oxidation: 150 product, test, and filler wafers. Exact load size process dependent. - Typical LPCVD: 150 product, test, and filler wafers. Exact load size process dependent. VTR System Operation - Standard Wafer Size: 150 mm and 200 mm - Optional Wafer Size: 100 mm and 125 mm - Low-Temperature Element of 250-600° C - Mid-Temperature Element of 500-1050° C - High-Temperature Element of 600-1200° C (Up to 1250° C for 4 Hours) - Uniformity: Flat zone, 22.5 in (57 cm) - Temp Control: ±0.5°C for Process Above 600° C - Class 1 Laminar Flow, Mirror-Finish 300 Series Stainless Steel Surfaces - ULPA Filter Tested to 99.9995% of Particles Greater Than 0.12 µm - Optional <100 PPM O2 Controlled Environment Available Process Models Available Atmospheric: - Wet/Dry Oxidation - Anneals - Forming Gas Anneals - Hydrogen Anneals - Phosphorus Predeoposition - POCl3 LPCVD: - Silicon Nitride (Dual Wall) - TEOS (Dual Wall) - Uniform Grain Polysilicon (Amorphous & Uniform Grain, N & P Doped) - HTO With over 1000 VTR systems currently in production use worldwide, it continues to maintain a global footprint for vertical furnace systems. This production proven semiconductor diffusion furnace design was originated by Silicon Valley Group (SVG) and is now a product line fully owned and supported by Expertech. A highly automated reactor with robust design features and a small footprint, Expertech's VTR system is one of the most well-known furnace designs worldwide. The VTR7000PLUS offers exceptional within-wafer and wafer-to-wafer uniformity in atmospheric and LPCVD processes. It is an ideal tool for advanced manufacturing, providing various benefits, including: - Manufacturing Versatility - Increased Automation & Throughput - Optimized Contamination Control - Reduced Cost-of-Ownership
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