By Tempress
The multipurpose Thermal Processing Platform The horizontal furnace TS series V is optimized for flexibility, multiple processes and cleanroom space. With its modular design the TS series V is available with up to four process chambers that can independently and simultaneously run a multitude of processes. The TS series V is future proof: process capabilities can be improved and extended over time with its upgradeable and configurable soft- and hardware and the wafer handling can be fully automated. Benefits. One furnace, multiple processes. - Range of processes combined in one tool - Modular designed - Upgradable, configurable hard- and software - Extended process capabilities and improvements Optimized cleanroom footprint. - Wafer size capability up to 300 mm - Stack flexibility 1 to 4 tubes - Flat zones up to 1250 mm Higher process stability and yield. - Tempress proprietary and well proven Digital Temperature Controller (DTC) for temperatures upto 1350 degrees Celsius delivers unprecedented temperature stability over long time. - Each tube has an individual DTC for optimum temperature control. Long economic lifetime, ready for the future. - Modular design - Reliable industrial components - Upgradable and configurable hard-and software - Self-diagnostics capabilities High uptime and process availability. - Shorter repair times. - Use of high quality, industrial components - Support in process optimization - Easy acces to Tempress expert knowledge Easy operation and high security. New advanced NTM furnace controller and software delivers: - Easy formulation and adaptation of process recipes and distribution over different furnaces without advanced programming skills - Data logging allowing improved feedback loops and improved process quality and yield - New touch screen user interface intuitive and easy to use for operators and process technologists Improved user management allowing easy operation, protection against flaws and improved security - One UI (User Interface) to control the entire furnace, process, recipe editing, control and monitor motions, boat movements, logging and analyses process variables and overview of the machine user interface Easy to integrate. Flexible and customized integrated automation options including Cassette-to-Cassette - Flexible interface between automation and furnace - Integrated 6 axis robot for wafer transfer - Proven wafer transfer system (installed base 500+) - Supporting 150-300 mm wafers Extra options - Edge contact or vacuum end effect - SECS/GEM E30 or SEMI 300 - OHT interface - Automatic Foup or SMIF opening - Ionizer - EDS combs - Storage/buffer positions - Batch transfer or single transfer System Characteristics TS 6-8-12 Horizontal batch furnaces tubes 2 to 4 (2 or 3 fot TS12) Wafer size 150-300 mm Cleanroom ISO 4 compatible Temperature Flatzone 300 – 1000 mm TS6 within ±0,5 °C 600-1250mm TS8 within ±0,5 °C 800-1000 mm TS12 within ±0,5 °C Control Cascade PID, accuracy ±0,1 °C Maximum 1300°C process Optional Fast cooldown (TS8 and TS12)
The VS series vertical furnace is a very economical, scalable and small footprint solution for smaller batch (up to 75 process wafers) wafer processing. The platform offers latest technology for a wide range of diffusion, deposition and curing processes. The very flexible multi-side installation capabilities yield optimal use of your cleanroom space. With wafer handling options ranging from manual loading to fully automated with OHT, the VS series allows for easy and cost-effective integration in any environment. Smaller batch, latest technology: The VS Series offers the ultimate solution for smaller batch (up to 75 wafers) wafer processing with no compromises to quality. The VS Series vertical furnace assures tight process performance in both the quality of the process and the cleanliness of the wafer handling. Optimal value of ownership: Designed for the handling of smaller wafer batches, the VS series’ low investment costs, economical use of auxiliary supplies and energy and its long lifetime assure an optimal value of ownership. Versatile process options: Similar to the TS Series horizontal furnaces, the VS Series offer a wide range of deposition, diffusion and curing processes. Multi-side installation capabilities on a very small footprint: The unique multi-side installation capabilities support a large set of configurations, allowing the most efficient setup for your cleanroom layout. Side-to-side placement as well as placement against a wall is possible, the loading position is configurable as well. With a typical height of less than 2.80 meters, it can easily be placed in cleanrooms with height restrictions as well. Wide range of wafer handling options: The VS Series is designed around the concept of smart flexibility. Flexibility in the VS Series facilitates processing of 150 and 200mm wafers. Processing of 300mm wafers is possible for a selection of processes. The smaller reactor allows for economically processing small batches of R&D wafers, while maintaining scalability towards high volume manufacturing with up to 75 process wafers on the same processing platform. Moreover, whether you choose to load your wafer manually or fully automatic, the VS Series will fit your environment and budget. Easy operation and high security: The advanced and proven NTM furnace controller and software delivers: - Easy formulation and adaptation of process recipes and distribution over different furnaces without advanced programming skills. - Data logging and detailed process monitoring allowing improvement in process quality and yield - New touchscreen user interface that is intuitive and easy to use for operators and process technologists - Improved user management allowing easy operation, protection against user mistakes and improved security of process IP. - One UI (User Interface) to control the entire furnace including process monitoring, wafer logistics, recipe editing, safety and extensive logging of process variables.
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