By memsstar
Keeps legacy etch and deposition tools at the top of their game The Applied Materials Centura platform is a versatile workhorse that supports multiple process applications including chemical vapor deposition, epitaxy, etch, plasma nitridation and rapid thermal processing for wafer sizes up to 200mm. Applied Materials’ P5000 was one of the world’s first single-wafer cluster systems developed for 200mm semiconductor processes. The “P” stands for precision. These tools set the gold standard for etch and chemical vapor deposition. memsstar continues to offer innovative solutions that are backward compatible and offer process improvements that keep these legacy etch and deposition tools from becoming obsolete. The ASP(+) heater upgrade kit for Applied Materials™ Centura and P5000 platforms are designed to replace original 14-lamp module assembly for improved reliability, easy maintenance, and lower operational and consumable costs. The new lamp module assembly replaces individual lamps with a resistively driven aluminium heater for: - Better process stability - Lower risk of damage to adjacent assemblies during maintenance - Reduced energy costs and CO 2 emissions - Elimination of replacement lamps - Improved strip rate uniformity - Constant energy usage of 0.8kW - Savings in consumables and engineering time - 2x higher MTBC - Greater uptime and availability
The memsstar ORBIS 3000 is a fully automated platform offering automated wafer handling, process integration, and cluster capability for high-volume MEMS production. It supports any combination of up to three XERIC or AURIX process modules on a single system. This makes it well suited to manufacturers scaling into full production who need multiple processes integrated on one tool. As the high-volume tier of memsstar's ORBIS platform family, it brings advanced automation and throughput to the fab floor. The ORBIS 3000's cluster capability lets manufacturers combine up to three XERIC or AURIX process modules in any combination on a single platform. This means multiple release etch and surface modification processes can be integrated together rather than run on separate stand-alone tools. Consolidating processes this way supports higher productivity and tighter process integration. It also gives fabs the flexibility to configure the platform around their specific process flow. The ORBIS 3000's XERIC and AURIX process modules can be easily integrated into existing fabs and later supplemented with additional modules. This lets manufacturers add capability as their capacity, productivity, or process needs grow over time. The result is a scalable platform that expands alongside the business rather than requiring wholesale replacement. This future-ready design helps protect a fab's long-term equipment investment. All ORBIS 3000 process modules are built on memsstar's unique technologies for advanced process control and faster process times. These technologies produce denser, more robust films for the AURIX and faster etch rates with maximum selectivity for the XERIC, all while delivering superior within-wafer uniformity and wafer-to-wafer repeatability. Each module uses a small-volume, process-specific vacuum chamber with an optimized process kit tuned to a particular process. Together, these capabilities help ensure consistent, high-quality results across high-volume production. Each ORBIS 3000 process module can handle all standard substrate sizes—100mm, 125mm, 150mm, and 200mm—along with many different carrier and substrate types. The platform uses industry-standard components in a compact footprint and connects easily to existing cleanroom facilities. It also minimizes the need for ancillary equipment to handle non-toxic chemicals, simplifying fab integration. Backed by memsstar's comprehensive equipment service, the ORBIS 3000 is designed for reliability and ease of maintenance. memsstar's ORBIS™ 1000 and 3000 systems provide cost-effective lab-to-fab upgrade paths from R&D through full-scale production. Seamless process transfer enables the single-wafer ORBIS 1000 platform, ideal for low-volume MEMS production environments, to be converted and upgraded to a fully automated ORBIS 3000 system. With easy integration of advanced XERIC™ (XeF2 and Vapor HF) and AURIX™ process modules, fabs can start with a single module and add additional modules to the Orbis 3000 cluster as capacity, productivity, or capability needs require.
CATEGORY
memsstar’s XERIC™ dry release etch process module is available using vapor HF (Hydrogen Fluoride) and XeF2 (Xenon DiFluoride) chemistries. Combined with the company’s AURIX™ surface modification process module, memsstar is a leader in providing industry-leading release etch and self-assembled monolayer solutions. memsstar’s XERIC system offers solutions for commercial R&D through to full-scale high volume manufacturing, by integrating memsstar’s ORBIS™ platforms to achieve the latest and most advanced processing. memsstar’s XERIC etch process module offers the strongest approach to effectively releasing MEMS structures from the sacrificial layer, while eliminating the problems associated with alternative approaches, including stiction, incompatible and poorly controlled wet chemistries, poor control and monitoring of stagnant gas systems, and multiplicity of unit process steps. Dry release processing from memsstar using the XERIC process module benefits from our advanced vapor delivery and chamber technology, enabling stiction-free and residue-free dry processing coupled with sophisticated process control and monitoring. XERIC offers solutions for commercial R&D through full-scale, high-volume manufacturing by integrating memsstar’s ORBIS platforms to enable the latest, most advanced processing. This gives customers a single, scalable technology path as they move from development to production. Combined with memsstar’s AURIX™ surface modification process module, ORBIS positions the company as an industry leader in release etch and self-assembled monolayer solutions.
CATEGORY
memsstar is an industry leading provider of semiconductor equipment parts. We have an extensive inventory of semiconductor components featuring Lam Research parts: 2300, Rainbow and Alliance; Novellus C1 and C2; and AMAT parts: Endura PVD, CVD, Centura Etch, CVD, RPD and P5000 for Etch and CVD applications. A global distribution network means that we are able to provide fast and efficient shipment of equipment parts worldwide. Can’t find the semiconductor part you need? Please contact us at: spares@memsstar.com and we will endeavour to source the spare parts required at the best available price. memsstar: Semiconductor equipment parts for etch and deposition distributed globally at competitive prices.
CATEGORY
memsstar’s proven etch processing technology is available for MEMS R&D efforts in a system designed for lab use, the ORBIS ALPHA. memsstar’s ORBIS ALPHA etchers bring the company’s proven technology to a platform designed to meet the price and performance requirements of the R&D community. What are the main features of the ORBIS ALPHA system for R&D? - Small footprint (size varies, dependent on model) - Self contained, XeF2 on board - DeviceNet control - LabVIEW control system - PC controlled - Resistive touchscreen What options are available with the system? - High selectivity option - Additional gas line - Camera - USB CCD Color Camera – for silicon system only - 640×480 pixel - Process monitor – unique to memssstar - Real time process monitoring
CATEGORY
