By Yield Engineering Systems (YES)
VertaPrime enhances the bonding needed for the build-up layers and the substrate core.
VeroTherm FAR can be used for Solder Balls, C4 Bumps, and µBumps needed for advanced packages.
CATEGORY
VertaCure offers a cure process for both build-up layers and the interposer.
TersOnus Platform can be specified for precise through glass via etching in substrates for enhanced connectivity in microelectronics. TersOnus Platform Electroless deposits metals critical advanced packaging build-up layers' connectivity.
