By Finetech
Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.
The Efficient Solution for Advanced Packaging The FINEPLACER® femto pro is a die bonder solution built for modern manufacturing in photonics, power electronics, and advanced sensor assembly. It offers a robust, scalable platform that delivers precision, high throughput, and long-term process stability. Developed for dynamic assembly, the FINEPLACER® femto pro strikes the optimal balance between speed and accuracy — supporting fast, repeatable bonding with minimal setup effort. It achieves 2.0 µm @ 3 Sigma placement accuracy and bonding forces up to 1,000 N, ensuring consistent results across demanding production tasks. Its compact footprint, low energy use, and minimal maintenance contribute to a low cost-per-bond and high overall equipment efficiency. The system supports ultrasonic, UV snap-curing, eutectic soldering, thermo-compression, and laser-assisted bonding — enabling short cycle times and compatibility with a wide range of materials and applications. A fully enclosed machine architecture maintains process cleanliness and operator safety, ideal for cleanroom or sensitive environments. Its modular design supports quick configuration changes and field upgrades, making it well-suited for both pilot runs and small- to medium-scale production. The intuitive IPM Command software allows rapid process setup and control. Built-in vision and pattern recognition ensure accurate, repeatable handling of small or delicate components. The FINEPLACER® femto pro is purpose-built for manufacturing — delivering the speed, precision, and flexibility required for efficient, high-yield assembly in dynamic production environments. Key Facts - Multi-chip capability - Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) - Wide range of controlled bonding forces - Placement accuracy of 2 µm @ 3 Sigma - Automatic placement accuracy calibration - Safe and controlled process environment with cleanroom quality - Various bonding technologies in one recipe - Wide range of supported component sizes - Overlay vision alignment system (VAS) with fixed beam splitter - Camera shifting for precision and wide field of view - In-situ process observation in HD - 3-color LED illumination - Full process access and easy programming - Data/media logging and reporting function - Synchronized control of all process related parameters - Modular machine platform allows in-field retrofitting during entire service life - Ultra low bonding force - Process module compatibility across Finetech platforms - Individual configurations with process modules - Integrated scrubbing function - Fully automatic and manual operation - Automatic tool management - Wide range of component presentation (wafer, waffle pack, Gel-Pak®) - Large bonding area - Excellent price performance ratio depending on configuration Functions - Modules - Enhancements Our die bonding solutions are as individual as our customers’ requirements and offer a wide range of configuration options. In addition to the system’s basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
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April 2026 – A significant step forward: the first wafer robot and load port systems have arrived for the FiNEXT P3 production die bonder and are now integrated into the prototype, enabling automated 12-inch wafer handling and forming the basis of the inline architecture. The wafer robot ensures precise, repeatable transfer between process steps. The load port enables controlled carrier interfacing, automated loading, identification, and full traceability. Together, they establish continuous material flow and support integration into conveyor and MES environments. With installation complete, the next phase focuses on application and workflow validation, especially wafer handling and chip-to-wafer processes where wafers act as both source and target. This marks another step toward a fully automated 12-inch production die bonding platform for scalable production. March 2026 – Check out this video of the upcoming high-mix volume die bonding platform FiNEXT P3, which is currently in development at Finetech. The calibration pick and place dry cycle is to test and ensure reliable 3 micron placement accuracy across the entire work area. Also shown is wafer loading from the new multi-slot wafer magazine, as well as die pick-up from the die eject module. With full 12-inch support and a 13-slot wafer magazine, the FiNEXT P3 is optimally prepared for sequential assembly processes at wafer level. Dies can be picked up from the source wafer either face-up or in flip-chip orientation using the die-flip module. February 2026 – Following an exclusive first look at Productronica 2025, Finetech has officially unveiled the beta prototype of its next-generation production die bonder platform. The modular system FiNEXT P3 supports multiple bonding technologies and 12-inch wafers, enabling manufacturers to consolidate diverse advanced packaging processes in a single platform. The automated production die bonder is designed for flexible yet stable and repeatable assembly workflows, using 12-inch wafers as both source and target. This enables semiconductor, photonics and sensor manufacturers to address demanding applications in advanced 2.5D and 3D packaging, heterogeneous integration, hybrid bonding and direct bonding. Development continues to evolve with production customer feedback. Increasing expectations for yield, quality and high-volume output are driving demand for scalable, automation-ready systems capable of handling new materials and more complex assembly architectures. October 2025 – At Productronica 2025, Finetech presents next-generation die bonding solutions. A key highlight will be an exclusive first look at Finetech’s new production platform, currently in development for high-mix die attach at scale. The system features automated wafer and die handling on a high-precision gantry, enabling efficient, repeatable workflows and supporting scalable manufacturing. It is being designed to incorporate ultrasonic bonding as its initial process capability and provides an open platform architecture to accommodate diverse process requirements.
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The Most Powerful Tool for Lab & Research The FINEPLACER®pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, the system is ideal for fast and flexible product development and prototyping in R&D labs and universities. We have designed the FINEPLACER®pico 2 to accommodate a large number of technology and process modules, as well as application-specific tools. Users can add third-party functionalities and further customize the bonding system at any time. If new functions are needed, the modular architecture allows on-site retrofitting throughout the entire service life. Getting started is effortless. The high-resolution vision alignment system supports adaptable fields of view and comes with adjustable RGB illumination. It can find the best color contrast between component and substrate and makes manual alignment straightforward and reliable. The spacious working area supports 300 mm wafers and enables batch processes. This is complemented by a high-resolution bonding force module with a wide range of available forces, which can handle a full spectrum of different components. Process creation is a breeze with the intuitive and powerful IPM Command bonding software. It allows users to concentrate on the core tasks involved in application development, thus minimizing operating errors. At the same time, users have access to an unparalleled range of parameter tweaking options for process optimization. The FINEPLACER® pico 2 follows our “Prototype to Production” approach of a cross-system, unified hardware and software platform. It enables R&D processes to be seamlessly transferred with all their technological diversity from development lab to production environment. By combining application flexibility, technological diversity, process reliability and compatibility with Finetech’s automated production bonders, the FINEPLACER®pico 2 offers an outstanding return on investment and is a natural starting point on the journey from concept to final product. Key Facts Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic), including reflow soldering Freely configurable RGB LED illumination for alignment Excellent price performance ratio Full process access & easy visual programming with touch screen interface In-situ process observation in HD Modular machine platform allows in-field retrofitting during entire service life Manual or semi-automatic machine versions Large bonding area Placement accuracy of 3 µm Unique FINEPLACER®working principle Synchronized control of all process related parameters Overlay vision alignment system (VAS) with fixed beam splitter Data/media logging and reporting function Synchronized control of all process related parameters Process module compatibility across Finetech platforms Individual configurations with process modules Wide range of controlled bonding forces Sequence control with predefined parameters Wide range of component presentation (wafer, waffle pack, Gel-Pak®) depending on configuration
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The Ultimate Tool for Opto Assemblies The table top flip chip bonder FINEPLACER®lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges. Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range. The table top die bonder FINEPLACER®lambda 2 shares a common module range and innovative operating software with Finetech’s automatic die bonding systems to ensure a seamless process migration to series production. Ask us about our scalable solutions. Key Facts - Sub-micron placement accuracy - Superior optical resolution - Excellent price performance ratio - Manual or semi-automatic machine versions - Individual configurations with process modules - Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) - Data/media logging and reporting function - Wide range of controlled bonding forces - Full process access & easy visual programming with touch screen interface - Various bonding technologies in one recipe - Process module compatibility across Finetech platforms - In-situ process observation in HD - Modular machine platform allows in-field retrofitting during entire service life - Synchronized control of all process related parameters - Overlay vision alignment system (VAS) with fixed beam splitter - Sequence control with predefined parameters depending on configuration
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