As semiconductor devices evolve into increasingly complex 3D architectures, metrology solutions need to advance to provide more comprehensive and full 3D profile insight. Transmission Electron Microscopy (T.E.M.) delivers high-resolution 3D reference data, while Atomic Force Microscopy (AFM) enables non-destructive surface characterization — yet neither provides non-destructive, in-line full 3D profiling, especially in extreme high aspect ratio structures. Building on the foundation of our propietary feed-forward trajectory planner (FFTP) mode, Nearfield Instruments introduces Sidewall Imaging Mode, combining sidewall force sensing, and advanced sensor fusion to determine the probe’s precise position in 3D space. The result is full 3D, non-destructive, in-line profile measurement — from individual features to full wafers — expanding process insight and strengthening manufacturing control. QUADRA with Sidewall Imaging Mode – available from March 2026
Automated High-Throughput 3D Scanning Probe Metrology 3D High-Aspect Ratio CD Metrology The big metrology challenges associated with manufacturing Gate-All-Around FETs include high aspect ratio processes, sub surface 3D features and aggressive pitches. Nearfield Instruments' newly developed Feedforward Trajectory Planner (FFTP) imaging mode enables on-device, non-destructive measurements to be used for in-line process monitoring of GAA FETs at 3nm and beyond. PRECISION Stability and Repeatability As a benchmark, "noise floor", using a "zero scan", has been used to assess AFM performance. But noise floor does not represent tool precision, repeatability, variation from strong scanning stage reaction forces in high speed imaging, reloading the wafer, and long-term drift, all influencing measurement quality. Revolutionary mechatronic concepts in QUADRA's architecture enable industry-best measurement precision and reproducibility. THROUGHPUT Speed and Productivity Time to information is crucial. QUADRA's architecture of miniaturized high-speed SPMs working in parallel increases throughput 100-fold compared to other automated single-probe AFM metrology tools for targeted in-line metrology applications. It also features high-speed navigation to the POI, probe exchange/alignment and unique data visualization to further increase productivity.
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Unprecedented imaging speed by combining enhanced signal processing algorithms and active control of fast-reacting cantilevers Faster wafer scanning providing deeper insight in process variations and improved yield control QUADRA with Lightning Mode – available from August 2024
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