X-Wire™ Applications X-Wire™ Technology Applications are: - Array & Multi-Row QFN - Low I/O Lead Frame - Wire Diameter Reduction (Gold) - Wire Sweep Yield Improvement - Die Shrink - Substrate Simplification - Power Applications - RF / Coaxial Wire Bonding Applications - Stacked Die - Flip-Chip to Wire Bond Conversion - Rapid Prototyping - Engineering Changes Area Array Direct-To-Ball Connection Long Wire Chip-to-Chip MCM TSOT Lead Frame Engineering Change
SALE Request for Pricing$18 Different colours may be requested. - 100% Copper-Infused Cotton - Minimum Order of 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 388MXC5t
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SALE Request for Pricing$18 Different colours may be requested. - 100% Copper-Infused Polyester - Minimum order 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 389MXC5t
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SALE Request for Pricing$18 Different colours may be requested - 100% Copper-Infused Nylon - Minimum Order of 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 390MXC5t
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In 2008, the semiconductor market quickly switched from gold wire to palladium-electroplated-copper wire and Microbonds had to rapidly innovate a new way of plating metals, such as copper, silver & zinc, and developed a proprietary process called ThermoPlating™, which is a breakthrough technology within the metal plating industry.
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