SALE Request for Pricing$18 Different colours may be requested. - 100% Copper-Infused Cotton - Minimum Order of 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 388MXC5t
SALE Request for Pricing$18 Different colours may be requested. - 100% Copper-Infused Polyester - Minimum order 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 389MXC5t
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SALE Request for Pricing$18 Different colours may be requested - 100% Copper-Infused Nylon - Minimum Order of 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 390MXC5t
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In 2008, the semiconductor market quickly switched from gold wire to palladium-electroplated-copper wire and Microbonds had to rapidly innovate a new way of plating metals, such as copper, silver & zinc, and developed a proprietary process called ThermoPlating™, which is a breakthrough technology within the metal plating industry.
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Microbonds Inc. has developed and is now commercializing a unique breakthrough technology called X-Wire™ Technology which consists of a proprietary nano-scale insulation coating material applied to bare gold and copper bonding wires that enables the development of faster, smaller and cheaper microchips while improving manufacturing reliability. Over the years the demand for smaller, more powerful and cheaper microchips constantly pushes designers and manufacturers to produce devices with higher densities and increased functionality. These densely packed devices are at electrical and physical limits where conventional wire bonds made from bare (non-insulated) bonding wires tend to touch and short-circuit causing manufacturing yield problems and restricting microchip designers from implementing further miniaturization or functionality. Over the past 20 years the microelectronic industry has concluded that many of these issues could easily be resolved if bonding wires were insulated and allowed to touch, cross and bundle without compromising product performance, cost and quality. Microbonds Inc. developed X-Wire™ Insulated Bonding Wire Technology to provide microchip designers and manufacturers with a viable and competitive solution to many of their design, manufacturing, and cost constraints.
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