By InZiv
Silicon photonics production testing Automated wafer-scale functional testing for silicon photonics — built for the throughput demands of high-volume manufacturing. Key Features High-Throughput Testing All-in-one system for functional testing of PIC devices at wafer scale. Passive Alignment Technology Vibration-free coupling with no active alignment required — seconds per device. Zero Device Damage Non-damaging contact throughout — the wafer is never harmed during optical or electrical testing. TECHNOLOGY How Glide-SiPh PIC Works InZiv's proprietary fiber array technology couples directly to silicon photonics wafers at wafer scale — delivering automated, multi-channel electro-optical testing without active alignment or device damage. Passive Alignment Vibration-free coupling with no active feedback loop required. The FAU aligns to the wafer edge in seconds — no hexapod, no iterative tuning. Patented Deep-Trench FAU A monolithic fiber array unit couples to edge-facets with minimal loss. Supports pitch down to 30µm and handles both edge-coupled and grating-coupled devices. Multi-Channel Probing Simultaneous optical and electrical characterization across multiple channels in a single automated pass — insertion loss, pass/fail, and yield mapping together. Full Wafer Automation Automated wafer loading, alignment, probe engagement, and stepping across 200mm and 300mm wafers. FOUP compatible. No optical recalibration between cycles. Key Measurements Multichannel optical and electrical characterization Optical insertion loss per channel Full wafer functional pass/fail testing Wafer-level yield and uniformity mapping
