By InkTec
Particle size: ≒ 20nm Material type: Disperse emulsion Ag concentration (wt%): 40 ~ 80 Application: Same as NP20
Features of InkTec’s TEC (TEC Transparent Electronic Cunductive) TEC was developed through the manufacturing process of soluble silver clusters, as opposed to the existing conductive ink that disperses nano particles. When the metal (Ag) is dissolved in solvent, it appears to be a clear liquid without particles, but after printing and heat treatment process, a high-density silver layer with superior conductivity is formed. It is clear with no concept of particles (sub-nano), has excellent stability, and enables low-temperature sintering and thin film materialization to be applied in various areas of the electronic parts material industry.
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Particle size: ≒ 20nm Material type: Wet cake Ag concentration (wt%): 85 ~ 90 Application: Low temperature sintering type, Higt electrical conductivity, Thermal conductivity, Electrode material for flexible printing electronics
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Conductive paste (High viscosity) Process method: Screen printing after exposure & devolopment (Photolitho graphic) Main components: Ag powder Applicables: Passive component (Inductor, LTCC, etc.), Photosensitive inner electrode
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