The SST 3250 is a high vacuum multi-atmosphere sealing furnace that has been designed for lid sealing on wafers of 150-200mm diameter. The system is fully operational at vacuum levels of 10E-07 Torr up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system. Category SST High Vacuum Furnaces Processes Glass to Metal Sealing, High vacuum MEMs Packaging, Hermetic Package Sealing, Solder Paste Reflow Attach, Fluxless Eutectic Solder Attach Applications - MEMS Package Sealing - Void-Free Eutectic Die Attach - Infrared Sensor Package Sealing - Low Moisture Package Sealing - Wafer Level Packaging - Military Electronic Package Sealing Key Features Run Analyzer Run analyzer provides ability to graphically review data from logged profiles and export data. This includes real-time display of the thermal and pressure profiles as well as the ability to aid in process development by helping identify plating or material changes in your products.
VisionPilot with Vision Standardization Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Vision Standardization ensure consistency across systems and throughout the lifetime of the machine; reducing process maintenance and maximizing production. Automated Tool Changer Automated access to nearly unlimited tools. Enables use of as many tools as needed for any process. Keep up to 8 tools loaded in the tool turret for near-instant access. Keep back-ups of tools on hand for rapid changing when current tools wear out. Bond Data Miner A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance. High Force Tool Option Reach high levels of force while maintaining high precision for low force operations. Tight planarity control even for extremely large components. Can automatically change tools while handling unique and oversized tools with ease at the high force position. Pulsed Heat Systems Highly accurate computer-controlled heating solution for solder based applications. Available in several forms ranging from a large surface area model to accommodate all part sizes to a heating source incorporated into the tool itself for localized heating. Dispensing Solutions Dispensing solutions range from the highly consistent Musashi Jetter which is not only surface height and temperature independent but also the highest throughput option for small controlled dispensing and the perfect option for 5G applications to the precisely controlled Nordson Micro Dot time-pressure solution which is capable of dispensing all the way down to “0.006 diameter dots. Automated Handler System Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for both die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders. UV Systems A wide variety of options for UV sources ranging from custom designed stages with mirrored surfaces and actuating covers for maximum UV exposure to head mounted UV sources with programmable intensities that can provide the perfect cure profile for the best results. Identification Systems Seamless integration with all types of barcode scanners, from 2D to 3D, which can be mounted on the bond head or integrated within the workspace of our bonders. Characters on chips can even be read with the onboard vision system. All identification information is tracked and collected in a report for easy review. Epoxy Stamp Station Designed to be simple and quick to maintain while supporting high repeatability daubing. Perform rapid cleaning in seconds due to quick release of blade and epoxy well. The repeatability and sturdiness of the design means greater consistency of daubing – both during production and between setups. Designed to inhibit overflow and conserve material use.
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The SST 8300 Series is an automated vacuum pressure soldering system setting new industry standards for flux-less soldering by providing highly reliable and reproducible solder interfaces using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit. Applications - IGBT Modules - Power Module Assembly - GaAs/GaN/SiC Die Attach - Die Attach for Pressure Sensors - High Intensity LED Attach - Multilayer Ceramic Capacitors - CPV Solar Cell Assembly - High Power Laser Module Assembly - Copper Clip Soldering - Hermetic Sealing of IR Image Sensors - Hermetic Sealing of Hi-Rel Packages QuikCool™ QuikCool™ is an auxiliary cooling unit designed to rapidly reduce the temperature of the target plate to enable a faster production process. The entire process takes place in one chamber to reduce handling and increase speed of production. Mid Vacuum Mid Vacuum option allows the oven to achieve a chamber vacuum level in the range of 10-5 Torr or lower. This option often used for the sealing of the IR Sensors, where specific vacuum level needs to be sealed inside the package for the optimal functionality of the sensor. Formic Acid Built-in formic acid delivery system to reduce surface oxides for high quality wetting. Formic acid is a two-temperature step operation which reacts with the surface oxides at low temperature and then decomposes at higher temperature, leaving a pure metal surface for optimal solder reflow. Run Analyzer Run analyzer provides ability to graphically review data from logged profiles and export data. This includes real-time display of the thermal and pressure profiles as well as the ability to aid in process development by helping identify plating or material changes in your products. Graphite Tooling – Design and Manufacture A full selection of products and services to meet your needs for precision graphite products. We combine our extensive inventory of premium graphite materials with engineering and design services, precision machining of graphite, ceramics and metals, and post-machining services such as cleaning, purification, coating and impregnation. Multi Chamber Multiple isolated chambers allow for different processes to run simultaneously within a single machine. Combined with the autonomous handling of components across chambers, entire assembly lines for vacuum reflow processes can be condensed into a single environment, controlled and managed from one interface.
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VisionPilot® is a state-of-the-art referencing technology that sets a new standard for vision processing on Palomar’s die and wire bond platforms that maximizes throughput and enables part inspection both before and after bonding. In contrast to standard referencing technology, VisionPilot utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations. It does so by using a set of boundary curves that are not tied to a traditional pixel-grid. It offers a wide range of tools and features to address the typical challenges of pattern recognition. This includes, but is not limited to, radar referencing, synthetic models, and active feedback. Category Die Bond Features, Wire Bond Features Processes Applications - Large complex hybrids - HB/HP LED arrays - Optoelectronic packaging - Microwave modules - RF packages - Hybrid microcircuits - MEMS / MOEMS - VCSEL, PD, DFB Laser, Lens Attach - Solid state lasers - RF GaN 5G power amplifiers - RF power amplifier Radar Referencing® Radar Referencing® allows the bonder to use shapes instead of standard pixel-to-pixel comparison. It finds shapes by dividing contrasting shapes. Using this method, component variations such as scratches, contamination, and probe marks can be filtered out. By only looking at shapes and outlines, the bonder can locate the component accurately and repeatedly. Synthetic Models Synthetic models allow the user to teach perfect shapes as opposed to using a pristine component sample. Due to the manufacturing process of the some components, there will be surface variation; no two parts will look identical. By comparing the actual (imperfect) components to a perfect model, the bonder can accurately locate the component. Active Feedback Active feedback shows the user how accurately the bonder is identifying a component. It uses colors to quickly indicate strengths and weaknesses of that particular reference image. When the actual (imperfect) part is compared to the perfect synthetic model, green indicates that there is a good match, yellow is acceptable, and red is poor.
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The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head. This machine has interchangeable 45-60° and 90° deep access wedge clamps and operates across a single large 304 x 152 mm work area. As the entire bond head mechanism rides on theta, users realize excellent wire tension, a shorter wire feed path and inherent prevention of twisting of wire and ribbon, and better overall process control. Category: Palomar Wire & Wedge Bonders Processes: Wedge Bonding, Gold Wire Bonding, Aluminum Wire Bonding Applications: - RF-SOE - Disk drives - Large complex hybrids - COB - RF and microwave devices - Compact hybrids - Fine pitch devices - Low profile wire bonds - Ribbon bonding - MCM power connections - Running stitch interconnects (die-to-die) - High frequency passive and active components VisionPilot® with Vision Standardization: Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Vision Standardization ensure consistency across systems and throughout the lifetime of the machine; reducing process maintenance and maximizing production. Bond Data Miner: A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance. Automated Handler System: Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for both die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders. Intelligent Interactive Graphical Interface® - i2Gi®: Supports advanced wire bond control through an intuitive interface that simplifies programming and provides real time graphical feedback to the user of bonding performance. Allows for a connected view with the ability to overlay 1:1 scaled graphics on top of live video of actual part. Process Viewer: High resolution live video of the bonding process focused at the tooltip. Allows for easy viewing of loop formation and bonding with great detail. Video is available on the same monitor as program status and process feedback, keeping operator attention focused and centralized in one location.
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