By Intlvac
Gridless Ion Source Power Supplies Advanced Digital Power and Control for Gridless Ion Sources The Intlvac Gridless Ion Source Power Supply is an advanced digital power and control platform engineered to deliver stable, efficient, and reliable operation for End-Hall ion sources. Built with modern switching power technology and integrated system control, the controller provides precise discharge and emission regulation while maintaining low stored energy and high operational stability. Designed for demanding thin film process environments, the system combines rapid response, intelligent system automation, and integrated gas flow control in a compact 19-inch rack-mount controller. Reverse compatibility with earlier Mark I and Mark II platforms allows seamless upgrades while improving plasma stability, reliability, and filament lifetime.
Advanced Digital Power and Control for Gridless Ion Sources The Intlvac Gridless Ion Source Power Supply is an advanced digital power and control platform engineered to deliver stable, efficient, and reliable operation for End-Hall ion sources. Built with modern switching power technology and integrated system control, the controller provides precise discharge and emission regulation while maintaining low stored energy and high operational stability. Designed for demanding thin film process environments, the system combines rapid response, intelligent system automation, and integrated gas flow control in a compact 19-inch rack-mount controller. Reverse compatibility with earlier Mark I and Mark II platforms allows seamless upgrades while improving plasma stability, reliability, and filament lifetime. Key Features Reverse Compatible - Remote I/O is pin to pin compatible - Faster operation & response - Digital & Switching technology - Quick start (learn) - More stable operation - Dual regulation - More reliable - Low stored energy & output limits - Longer filament lifetime - Filament soft-start - Triple filament lifetime option Technical Specifications Filament Version Products: Mark I and Mark II Filament: 7A emission current, Soft Start Discharge: 1A or 5A & 170V DC, Standard and low voltages Autocontroller: System Control, Gas Control - 4 MFCs, Open or closed gas loop control, Automatic Start/Stop Sequence Remote Interface: Isolated analog & RS-232 Interchangable: Mark I & Mark II reverse compatible Size: 19” rack mount, 3U (13.3cm) Hollow Cathode Version Products: Mark I, Mark II, Mark II HO, Mark III Filament: 10 A emission current, Soft Start Discharge: 10A or 5A & 300V DC, Standard and low voltages Autocontroller: “Autopilot” System Control, Gas Control - 4 MFCs, Open or closed gas loop control, Automatic Start/Stop Sequence Remote Interface: Isolated analog & RS-232 Interchangable: Mark I & Mark II reverse compatible Size: 19” rack mount, 3U (13.3cm) Why Choose Intlvac Thin Film? Intlvac Thin Film systems are built for precision coating, research flexibility, and industrial reliability. Our ion source power and control platforms deliver stable plasma performance, simplified system integration, and dependable operation in demanding vacuum coating environments. With advanced switching power technology, integrated gas control, and reverse compatibility with earlier Mark-series systems, Intlvac controllers help reduce downtime, simplify upgrades, and ensure consistent thin film processing across research and production platforms. We combine advanced plasma engineering with practical system design to deliver reproducible, high-quality thin films.
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Ion Beam Etching is a highly controlled physical sputtering process in which energetic ions are directed toward a substrate to achieve precise, anisotropic material removal. The broad, collimated ion beam ensures excellent uniformity across the substrate surface, while programmable substrate motion further enhances process consistency. The result is repeatable, chemistry-independent etching suitable for advanced thin film patterning and precision component fabrication. Other Systems - Nanoquest I - Nanoquest III - Nanoquest Pico
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Reactive Ion Beam Etching combines physical ion bombardment with reactive species generated within the ion source. The simultaneous chemical and physical interaction enhances etch efficiency, improves selectivity, and enables refined feature definition. This approach is well suited for structured surfaces requiring controlled profiles and optimized throughput. Other Systems - Nanoquest I - Nanoquest III - Nanoquest Pico
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Ion Beam Trimming utilizes a finely defined ion beam to selectively remove material with nanometer-scale precision. Through controlled beam scanning and dwell time adjustment, material thickness can be tuned locally to achieve targeted device or performance characteristics. The process enables deterministic, high-accuracy corrections in advanced functional components. Other Systems - Nanoquest I - Nanoquest III - Nanoquest Pico
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