MesoGlue metallic glues can be used as a thermal interface material to connect a CPU or other power dense devices to a heat sink. This eliminates many of the problems that are encountered when seeking suitable attachment methods. - Metallic glue can be used on aluminum or copper heat sinks, and can be attached to heat-spreaders or to silicon dies. - Metallic glue has a very high thermal conductivity (300-425 W/m*K ) as compared to common thermal greases(~1-10 W/m*K ) allowing much more effective heat transfer from the CPU to the heat sink. - Metallic Glue experiences no pump-out or drying problems.
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only light pressure (<100 psi).
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MesoGlue Liquid is our patent pending process to produce bonds between items with an all metal connection. We combine the principles of a 2-part epoxy with hot gluing to make a simple to use solution. Our room temperature formula is a safe and simple for soldering, metal repairs, and 3D printing of metals. Our high temperature formula is stable to higher temperatures for more demanding situations such as electronics in extreme environments or wide-bandgap semiconductors.
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A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure (100-1000 psi) or temperature (20-100ºC).
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