By Lumentum
Lumentum’s 1.6T 2×DR4 TRO OSFP transceiver delivers ultra-high-speed optical connectivity for AI and cloud data centers requiring the highest density and energy efficiency. Each module integrates eight electrical and eight optical channels operating at 212.5 Gbps PAM4 per lane for an aggregate data rate of 1.6 Tbps. With integrated DSP and silicon photonics (SiPh) technology, it provides excellent signal integrity and reach up to 500 meters over single-mode fiber. The TRO design features only transmit-side retiming to reduce power dissipation and total cost of ownership (TCO), offering an optimized balance between performance and efficiency for large-scale deployments. With typical power consumption of only 16 W, CMIS 5.3 management, and dual MPO-16/APC interfaces, the 1.6T 2×DR4 TRO OSFP transceiver enables high-performance, scalable optical fabrics for next-generation AI, HPC, and cloud network architectures.
Lumentum’ s external laser source form factor pluggable (ELSFP) module provides a centralized, serviceable light source for co-packaged optics (CPO) systems in AI and cloud data centers. By removing continuous-wave (CW) lasers from the switch or ASIC package, the ELSFP enables multiple silicon photonics (SiPh) optical engines to share a single, high-power laser source—improving system efficiency, thermal performance, and serviceability. By using Lumentum’s ultra-high-power (UHP) laser, the ELSFP delivers the optical power, spectral purity, and stability required as port counts and data rates scale beyond 100 Tb/s. Operating at 1311 nm, it achieves up to 24 dBm optical output per wavelength with dual-TEC thermal control for consistent performance. Built on Lumentum’ s proven heritage in high-reliability laser manufacturing and vertically integrated supply chain, the ELSFP combines unmatched optical performance with production scalability and field-proven quality. Designed for high-volume manufacturing and field replaceability, the ELSFP module enables scalable, energy-efficient optical fabrics for next-generation AI and cloud networking architectures. Features and Benefits - Centralized ELSFP module powers multiple CPO engines - Delivers up to +24 dBm optical output per wavelength at 50°C - Integrates Lumentum’ s UHP laser technology for industry-leading optical power, spectral purity, and long-term stability - Narrow linewidth (<500 kHz) and low relative intensity noise (RIN) for clean, low-noise optical links - Optimized for 1311 nm O-band operation with dual-TEC thermal control for precise wavelength stability - Compact, non-hermetic pluggable form factor engineered for high-volume manufacturing - Removes laser heat from the ASIC, GPU, or switch, improving thermal margin and enabling denser system integration - Shared light source design supports multiple optical engines, reducing total cost of ownership (TCO) and simplifying maintenance - Field-replaceable, pluggable design enhances uptime and operational flexibility in hyperscale environments - Delivers stable, low-noise optical power compatible with both coherent- and SiPh-based CPO platforms Applications - ELS for CPO in AI-driven networking architectures with I/O 100 Tbps - Powering SiPh optical engines requiring stable 1311 nm light sources - Shared laser pools supporting 800G and 1.6T deployments with a path to 3.2T - Hyperscale data centers standardizing on a pluggable, high-volume external laser module
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The Lumentum R300 Optical Circuit Switch (OCS) brings a new level of scalability, latency, and power efficiency to cloud‑scale and AI/ML data center networks. Built on field‑proven Lumentum micro‑electro‑mechanical systems (MEMS) technology with over a trillion mirror operating hours, the R300 establishes direct optical paths between endpoints—eliminating intermediate packet processing and optical‑electrical‑optical (OEO) conversion. The result is dramatically lower latency, higher signal integrity, and significant reductions in network power for large GPU clusters. Features and Benefits - High‑radix 300×300 optical switching for dense, scalable interconnect fabrics in front‑end and back‑end data center networks - Ultra‑low latency direct optical paths—5–10× lower than packet‑switched alternatives - Power‑efficient architecture: eliminates repeated OEO conversions - Wideband operation across O and C bands for maximum wavelength plan flexibility and future‑proof upgrades - Protocol‑agnostic optical core supports Ethernet, InfiniBand, and proprietary links at any data rate within supported bands - Reliability at scale: proprietary MEMS control without closed‑loop dither, plus redundant fans and power supplies and hot‑swappable control electronics. - Operational simplicity: fully passive optical switching core; modular design simplifies service and minimizes downtime - Open integration with SDN/orchestration via standard management interfaces (e.g., gNMI) for dynamic path provisioning Applications - AI/ML training and inference fabrics (east‑west heavy traffic) - Spine replacement and scale‑out/scale‑up GPU cluster interconnects - Front‑end and back‑end data center networks - Data center interconnect (DCI) - Optical transport/telecom environments seeking deterministic, low‑latency switching
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Lumentum’s 200G electro-absorption modulated laser (EML) is our next-generation product for high-density, energy-efficient optical connectivity. Each device pairs a wavelength-locked DFB laser with a single-ended electro-absorption modulator (EAM) to deliver clean 200G-per-lane transmission with low power consumption. Designed for CWDM4 operation at 1271, 1291, 1311, or 1331 nm, it supports 115GBd PAM4 signaling for 200G-per-lane transmission in DR and FR links up to 2 km. The 200G EML provides high bandwidth, high extinction ratio, and stable performance under datacenter thermal conditions. Built on our InP platform proven in reliability and manufacturability, it enables scalable 1.6T pluggable transceivers with eight 200G lanes, meeting the speed, power, and reach demands of next-generation AI and cloud data center architectures. Features and Benefits - Extinction ratio (ER): ~5 dB - CWDM wavelengths: 1271, 1291, 1311, 1331 nm - Supports 115GBd PAM4 modulation - Cooled operation (~55°C typical) - Single-ended drive architecture - Enables 1.6T transceivers with eight 200G lanes with reach up to 2 km - Compact, low-power design for high-density DR and FR modules - GR-468 qualified for long-term reliability and manufacturing scale - Platform with proven high-volume manufacturability
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From smartphones to wearables, VCSELs are central to today’s most advanced consumer technologies. Lumentum’s VCSEL (vertical-cavity surface-emitting laser) solutions have been deployed in billions of devices worldwide — enabling precision sensing at scale. Lumentum is a global leader in VCSEL technology for consumer electronics, supporting applications like 3D facial recognition, proximity sensing, biometric security, and augmented reality. Our compact, energy-efficient VCSEL arrays deliver fast response, consistent beam quality, and high reliability — making them ideal for integration into space-constrained, high-volume products. Built on decades of photonics expertise and proven in the field, our VCSELs continue to power innovation across the world’s most widely adopted consumer platforms. Applications • 3D facial recognition for secure device access and authentication • Proximity and ambient light sensing for enhanced user experiences • AR/VR integration with structured light and depth-sensing support
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