
By Soitec
Our RF-GaN increases the high-frequency system efficiency and power density of next generation sub 6GHz and mmWave-band cellular 5G infrastructures and mobile devices. GaN beats GaAs or Si-technologies when it comes to higher system efficiencies, power density, linearity, size reductions and lower current consumption. Low-voltage GaN technology can even address today's sub 6 and mmW band power devices in 5G smartphones. Soitec's RF-GaN product family consists of state-of-the-art (In,AI)N/GaN and (AI,Ga)N/GaN hetero epitaxial layer structures deposited crack-free on up to 200mm (111) high-resistance Si or 150mm semi-insulating SiC substrate for RF applications. We offer optimized layer structures addressing sub6 and mmW 5G bands. Our proprietary high-voltage buffer is Fe-free and delivers high breakdown voltage, low trapping effects and RF losses and a consistently low wafer bow. High Power Density RF GaN epiwafers provide higher power density compared to traditional semiconductor materials like silicon, enabling more powerful and efficient RF amplifiers in compact designs. Wide Bandgap GaN's wide bandgap allows for operation at higher voltages and temperatures, improving device performance and reliability under extreme conditions. High Efficiency GaN devices offer greater energy efficiency, reducing power consumption and heat generation, which is crucial for maintaining the performance of 6G handsets. High Frequency Operation GaN's material properties support operation at higher frequencies, making it ideal for millimeter-wave (mmWave) technologies required in 6G networks or radar applications in Ka and Ku bands. Thermal Conductivity GaN epiwafers have better thermal conductivity compared to silicon, aiding in better heat dissipation, which is essential for maintaining device longevity and performance. Faster Switching Speeds GaN transistors can switch faster than silicon-based transistors, leading to quicker signal processing and improved overall system performance in RF applications.

Soitec's Power-SOI empowers electric and autonomous vehicle innovation. Our industry-leading engineered substrates enable the development of advanced automotive applications, delivering superior energy efficiency, performance, robustness, integration, sustainability, faster time-to-market and intelligence. It meets enhanced FuSa standards and 48V architecture requirements. Power-SOI Features & Benefits High voltage & low voltage integration on the same die: Power-SOI with DTI (deep trench isolation) enables integration of high and low voltage blocks on a single die, minimizing die area. High temperature operation: Power-SOI's superior low leakage at high temperatures enhances temperature margins, facilitates AEC-Q100C Grade 0 certification, and improves device accuracy. High robustness: Power-SOI's excellent noise immunity, latch-up-free structure, and enhanced ESD/EMI/EMC properties enable high-performance power ICs that meet stringent robustness requirements. Simple device design: Power-SOI simplifies device design, reducing mask count and eliminating complex well structures. It also improves BV-Rsp performance through double RESURF High Efficiency: Power-SOI technology often enables devices to work with higher efficiency by offering the lower on resistance (RDSon) and lower reverse recovery charge (Qrr). This benefit is crucial for energy-sensitive applications, particularly in automotive and mobile devices, contributing to longer battery life and energy-efficient performance. Scalability for Future Nodes: Power-SOI is highly scalable for future technology nodes, making it adaptable to evolving needs in semiconductor manufacturing. This scalability ensures that Power-SOI will remain relevant in future generations of ICs, allowing for integration of new functionalities without increasing die size or complexity. Connecting the world with Soitec Power-SOI substrates Soitec's Power-SOI substrates enable smart power management in electric vehicles (EVs) and advanced driver-assistance systems (ADAS), meeting high functional safety standards and supporting 48V low-voltage architectures for better efficiency. Their robustness and high-temperature tolerance make them ideal for powertrain and under-hood components. In industrial applications, Power-SOI substrates offer durability, noise immunity, and energy efficiency, simplifying power IC design by integrating high- and low-voltage components. They are essential for reliable operation in harsh environments, particularly in motor drives, inverters, and automation systems. Power-SOI substrates enhance energy efficiency and performance in datacenters and network infrastructure by supporting efficient power supply circuits and high-speed signal processing. Their ability to operate in high-temperature environments ensures reliable performance in demanding computing and telecommunication systems. Highlights Efficient smart power IC: Power-SOI improves 10% system cost and smart power IC efficiency. Safer smart power IC: Power-SOI facilitates smart power IC development, meeting high robustness, noise immunity, and operating temperature requirements. Better performance smart power IC: Power-SOI improves 10% system cost and smart power IC efficiency. Increased Voltage Handling Capacity: Power-SOI enables high voltage isolation capabilities, supporting up to 200V in smart power ICs. This allows for better integration of high-voltage and low-voltage components on the same die, which is essential in applications like power converters and motor drivers. Frequently asked questions Which applications use Power-SOI? - IVN (In-vehicle Networking) such as CAN, LIN, FlexiRay, Ethernet Phy ICs - PMIC (Power Management IC)/ SBC (System Basis Chip) - BMIC (Battery monitoring IC)/ BMS AFE (Battery management system analog front end) - Gate driver IC - Smart actuator/ smart motor controller IC - Industrial interface IC - HiRel (High Reliability) IC etc. What are the benefits of using Power-SOI? - To enable high integration of high voltage circuits and low voltage circuits on the same die for saving die area - To provide high robustness and reliability for meeting higher functional safety (FuSa) requirements - To ease the IC design with increasing demands of wider operating temperature and higher FuSa requirements - To shorten the IC development time by ensuring higher percentage of first time right design which improves the time-to-market - To improve the efficiency of the power IC by reducing the conduction losses and switching losses What are the key inflections that Power-SOI addresses? - The new 48V low voltage architecture: Power-SOI enables higher breakdown voltage (BV) which is needed for this architecture (said 200V BV) - Increasing demands for higher functional safety (FuSa): Power-SOI enables the integration of high voltage circuits and low voltage circuits by providing excellent noise immunity with DTI & BOX, latch-up free structure and significant reduction of isolation area - Package downsizing: Power-SOI low leakage current at higher junction temperature and much smaller die size allow the use of smaller package size How many product families are inside Power-SOI product portfolio? 200mm Power SOI - Smart Power 1.5: SmartCut ™ SOI EPI ready only up to 1.5um SOI thickness with BOX up to 3.0um - Smart Power 2.0: SmartCut ™ SOI + EPI (up to 10 um) with BOX up to 3.0um - Smart Power 2.1: SmartCut ™ SOI + EPI (up to 10um) with 3.1um to 3.9um BOX 300mm Power SOI - Smart Power 3.0: SmartCut ™ SOI EPI ready only up to 0.2um SOI thickness with BOX up to 2um - Smart Power 3.1: SmartCut ™ SOI + EPI (up to 7um) with BOX up to 2um
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Photonics-SOI from Soitec is an advanced technology platform that integrates photonic components on a silicon-on-insulator (SOI) substrate to enhance optical communication capabilities. Photonics-SOI offers significant advantages for optical transceivers, including high data rates, cost efficiency, power savings, compact size, and improved signal integrity. These benefits make it a compelling choice for high-speed data center interconnect applications. Photonics-SOI provides several advantages for personal healthcare sensors, including miniaturization, cost efficiency, high sensitivity, and integration capabilities. These benefits enable the development of advanced, compact, and accurate monitoring devices for health applications. Photonics-SOI is used in Light Detection and Ranging (LiDAR) devices which are increasingly being used in Advanced driver-assistance system (ADAS), mobile and consumer applications. Photonics-SOI enables the implementation of Quantum Key Distribution (QKD), a method for secure communication based on quantum principles. Silicon-based photon sources and detectors can be used to create and distribute quantum keys between parties, ensuring secure data transmission. Enhanced Bandwidth and Speed The technology supports high-bandwidth and high-speed optical communication, addressing the increasing demands for data transfer in data centers, telecommunications, and computing systems. Integration and scalability By leveraging silicon’s established manufacturing processes, Photonics-SOI supports scalable production and seamless integration with existing silicon electronics, facilitating the development of compact, high-density optical systems. Reduced power consumption Photonics-SOI contributes to lower power consumption by utilizing optical signals for data transmission, which is more energy-efficient than traditional electrical interconnects, especially over long distances. Soitec provides innovative solutions for high speed and robust connectivity in data center interconnect and network infrastructure connectivity. By offering superior thermal management and reduced power consumption, Soitec's substrates help optimize the operation of servers and networking devices, enabling faster data processing and lower energy usage. Soitec offers a portfolio of solutions which enhance the performance and efficiency of Edge AI and IoT applications. By providing high-quality, energy-efficient substrates, Soitec helps to optimize IoT devices by enhancing their reliability and extending battery life, making them ideal for real-time data processing and communication in various applications. Soitec empowers electric and autonomous vehicle innovation. Our industry-leading engineered substrates enable the development of advanced automotive applications, delivering superior energy efficiency, performance, robustness, integration, sustainability, faster time-to-market and intelligence. Soitec empowers smart industrial applications and enables industry leading industrial automation. Our industry-leading engineered substrates enable the development of advanced industrial applications, delivering superior energy efficiency, performance, robustness, integration, sustainability, faster time-to-market and intelligence. Current world’s semiconductor capacity and the demonstrated large scale manufacturability of engineered substrates have provided the possibility for every person in the world to afford at least one device - a smartphone for most - able to acquire, process and communicate information of its surroundings. As the leader in engineered substrates, Soitec is helping enterprising customers and partners in ensuring that their products meet the ever-increasing expectations in consumers' Quality-of-Experience. Our engineered substrates help ensure end-to-end energy efficiency, fast, secure and reliable data acquisition and processing and robust broadband connectivity. In what applications is Photonics-SOI being used? Photonics-SOI is used in a wide range of applications from data center interconnect, LiDAR, personal healthcare to quantum technologies. What are the benefits of using Photonics-SOI in an optical transceiver? Photonics-SOI offers the advantages of enhanced bandwidth and speed, higher integration and scalability, and reduced power consumption.
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FD-SOI enables energy efficiency and seamless connectivity FD-SOI technology provides the optimal balance between digital performance, mixed signal/RF compatibility, power consumption and cost. The ultra-thin film FD-SOI architecture enables transistors to operate in fully depleted mode, offering an “electrical Shrink-on-Chip” solution while simplifying the manufacturing process. How FD-SOI will impact your products Low Active Power Consumption FD-SOI outperforms alternative technologies in terms of energy efficiency at a given technology node. Performance on demand Body bias feature provides a very powerful knob for fabrication process, voltage, temperature and aging (PVTA) compensation and performance boosting. Ultra-low leakage with ultra-low VDD - Always ON FD-SOI is an ultra low-voltage technology which is able to operate at very low VDD at minimum energy per operation. Compact Solution FD-SOI enables easy digital / analog RF integration which offers an optimum solution for wireless connectivity applications. Superior RF Performance Planar FD-SOI technology reduces parasitics, enabling higher ft/fmax values - key for pushing the limits of RF design performance. Enhanced Noise Immunity for RF Applications Thanks to their insulating layer, FD-SOI substrates offer superior interference isolation, making them ideal for highly integrated RF and analog mixed signal circuitry in 5G mmWave, Wi-Fi, Bluetooth and a wide range of other wireless systems. Where FD-SOI technology is being used Soitec offers a portfolio of solutions which enhance the performance and efficiency of Edge AI and IoT applications. By providing high-quality, energy-efficient substrates, Soitec helps to optimize IoT devices by enhancing their reliability and extending battery life, making them ideal for real-time data processing and communication in various applications. Soitec provides innovative solutions for high speed and robust connectivity in data center interconnect and network infrastructure connectivity. By offering superior thermal management and reduced power consumption, Soitec's substrates help optimize the operation of servers and networking devices, enabling faster data processing and lower energy usage. Soitec empowers electric and autonomous vehicle innovation. Our industry-leading engineered substrates enable the development of advanced automotive applications, delivering superior energy efficiency, performance, robustness, integration, sustainability, faster time-to-market and intelligence. Soitec empowers smart industrial applications and enables industry leading industrial automation. Our industry-leading engineered substrates enable the development of advanced industrial applications, delivering superior energy efficiency, performance, robustness, integration, sustainability, faster time-to-market and intelligence. From MHz to mmWave frequencies, semiconductors built on Soitec’s FD-SOI substrates consistently deliver high performance and low power consumption across a wide range of wireless applications - from IoT and smartphones to 5G mmWave and advanced terrestrial and satellite networks. Highlights Widely used in major smart watches and hearing aids. Widely adopted in leading 5G mmWave-enabled smartphones. Widely adopted for next-generation radar SoCs for the automotive industry. Widely used in advanced driver assistance systems (ADAS), FD-SOI technology helps ensure reliability in harsh environments while maintaining energy efficiency. FD-SOI substrates form the basis for energy-efficient AI processing. Frequently asked questions In what applications is FD-SOI being used? Due to its unique superior characteristics, FD-SOI is used in a wide range of devices from a low power microcontroller, embedded wireless controller, radar and mmWave. These devices are used in market segments from wearable and hearable, automotive infotainment system, software-defined vehicle, mobile and consumer. What are the benefits of FD-SOI? FD-SOI technology allows always-on feature and longer battery life-time in a battery-operated smart home or wearable device. It provides digital and analog/RF integration which makes it an ideal solution for wireless controllers used in IoT, mobile and automotive radar applications.
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Advanced substrates offer higher precision, enhanced mechanical performance, and lower power consumption for high-performance sensors MEMS-SOI enhances sensor performance Soitec's MEMS-SOI offers the benefits of higher precision, enhanced mechanical performance and lower power over traditional MEMS technologies to high performance sensors. MEMS-SOI sensors benefit from improved sensitivity due to reduced electrical and mechanical noise, allowing sensors to detect smaller changes in the measured parameter more effectively. The reduction in parasitic capacitances and the improved isolation provided by the SOI substrate can lead to faster response times for MEMS sensors. This means that sensors can react more quickly to changes in the measured parameter, which is crucial for dynamic applications. How MEMS-SOI will impact your products Higher precision and accuracy SOI substrates offer a high degree of uniformity and precision in device fabrication, leading to more consistent and reliable MEMS devices. This is particularly important in applications requiring tight tolerances and high performance. Enhanced mechanical performance The SOI substrate provides a high-quality, low-stress silicon layer that improves the mechanical properties of MEMS devices. This can lead to better precision, higher resonant frequencies, and improved stability of MEMS structures. Reduced power consumption MEMS-SOI devices typically exhibit lower power consumption compared to traditional MEMS technologies. The reduced parasitic capacitance and efficient thermal management contribute to lower energy requirements, which is beneficial for battery-operated and portable applications. Where MEMS-SOI technology is being used Edge AI & Internet of Things MEMS-SOI enhances the user experience in AR/VR glasses and headsets by enabling chipsets to do real-time motion detection, precise head tracking, and eliminating image distortions for a more immersive experience. Automotive MEMS-SOI enables accelerometers and gyroscopes that are used in airbag systems to detect rapid deceleration and activate airbags instantly during a collision. They also support stability control, traction control, and anti-lock braking systems (ABS) by monitoring vehicle dynamics. Mobile & Consumer MEMS-SOI enables sensing solutions that are present in devices we use everyday, such as smartphones, hearable and wearable, where they enable a variety of tasks such as image stabilization, user interfaces and power management. Industrial MEMS-SOI enables accelerometers and vibration sensors to monitor equipment health by detecting early signs of wear, misalignment, or malfunction. This data enables predictive maintenance, reducing downtime and repair costs by addressing issues before they become critical. Frequently asked questions In what applications is MEMS-SOI being used? MEMS-SOI is commonly used in high performance sensors. These sensors can be found in a wide range of applications from Edge AI and IoT, Industrial, Automotive, Mobile and Consumer market segments. What are the benefits of MEMS-SOI? MEMS-SOI provides the essential features to a high performance sensors in terms of higher accuracy, shorter response time, increased mechanical ruggedness and lower power consumption.
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