STU (Simultaneously Thermal and UV) process capability Highlights Fully automated production tool lndustry leading cost-of-ownership Throughput up to 70 WPH ln-line CVD anti-stick of IPS® ln-line IPS® resist coating Features Reliable High Volume Manufacturing capabilities Sub 20 nm resolution Excellent CD control Substrates sizes up to 300 mm Ø Highlights Fully automated & modular NIL system Available modules; substrate clean, coat, bake, alignment and nanoimprint as well as integrated IPS manufacturing and antistick treatment Throughput up to 45 WPH Features Integrated resist processing Integrated alignment function Reliable High Volume Manufacturing capabilities Sub 20 nm resolution Excellent CD control Substrates sizes up to 500x500 mm
Fully automated coater and developer The Microcluster tool is available in 200- or 300-mm versions and is a fully automated cassette-to-cassette coater developer. The Microcluster tool is configured with four modules and offers high flexibility and represents the ideal configuration for R&D and pilot production needs meeting industry requirements with excellent uniformity and process repeatability..
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Fully automated wet processing Track tools The Microcluster WET Track tools are available in 200-, 300- or up to 1500 mm versions and are fully automated cassette-to-cassette wet processing solutions. The Microcluster WET tools are configured with five modules or more which can be dedicated to performing cleaning-, lift-off-, etching- or developing processes. The Microcluster WET Track tools offers a high level of versatility and adaptability which makes it very suitable for High Volume Manufacturing needs meeting industry requirements with superior uptime, process repeatability, high yield and competitive Cost-of-Ownership.
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Obducat’s revolutionary Rotating Covered Chuck Technology (RCCT™) process environment design provides for: - A completely sealed solvent saturated atmosphere - Minimal turbulence around the substrate eliminating rotational corner effects on squared substrates, enabling industry leading uniformity across the entire substrate at lower spin speeds. - Superior coating uniformity on submicron layers as well as for thick resist layers compared to open bowl. - Reduced process cost and improved environmental profile by lowering material consumption. - Elimination of Backside Rinse (BSR).
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