By LatticeGear
Scribing and Cleaving Kits Scribing and Cleaving Kit for Small Samples This kit includes: Small Sample Pliers, two rulers, an ultra fine tipped permanent marker, sample handling tweezers, a pen style diamond scribe, and a handy case to keep all of the tools together. These tools are for thin and small samples below 30 mm. Marker-Scriber Kit Our set of diamond scribers enable fine marks and scribes on the wafer surface. This step is critical in achieving an accurate cleave. Three diamond scribers are included: a pen style retractable scriber, a short handled straight scriber and a long handled 30° angled scriber. The Cleaving Station-with large mat The Cleaving Station with Large Mat includes all of the hand held tools needed to reduce a full wafer to samples a few millimeters in size. The station includes a variety of scribers to create weak point in the sample. Two pliers are included for a variety of sample sizes. A large self-healing mat is included to keep the workplace clean. A box is included to organize the workspace. The Cleaving Station-without large mat The Cleaving Station has everything needed to scribe and cleaving using handheld tools. It has scribers for marking and weak point creation and pliers for full wafers and samples several mm wide. The handy box keeps everything together. Cleaving Kit-with large mat This kit contains the handheld tools needed to scribe and cleave wafers cleanly down to 20 mm samples. The diamond tipped scribers are used for a critical precleave scribe, for the most accurate cleave with the CleanBreak™ pliers. The kit includes a large self-healing mat and tools to assist in the cleaving process. The tools are suitable for a variety of materials including Si, GaAs, and glass. Cleaving kit- without large mat This set includes hand held tools to scribe and cleave samples cleanly down to 20 mm. The three scribers have diamond tips, for a critical precleave scribe, necessary for an accurate cleave with the CleanBreak™ pliers. The kit includes additional tools which are helpful to achieve a clean sample. This kit is suitable for a wide variety of substrates and wafers (Si, GaAs, glass). Carbide Cutter Cleaving Kit Handheld tools for cutting and cleaving glass, silicon and hard materials. The carbide cutting wheels create a clean scribe line with minimizing of particles in comparison to pointed diamond scribe. Allows substrate to split cleanly. 5” Plastic handle. Includes 3 carbide cutters, 8” and 6” Cleanbreak Pliers for cleaving small and large samples, thick and thin, 12”x9”(300mmx226mm) cleaving mat, and 8”/200mm with metric and inches L-square ruler (for use as a straight edge measuring samples.
SKU :CC-KIT-100 Handheld tools for cutting and cleaving glass, silicon and hard materials. The carbide cutting wheels create a clean scribe line with minimizing of particles in comparison to pointed diamond scribe. Allows substrate to split cleanly. 5” Plastic handle. Includes 3 carbide cutters, 8” and 6” Cleanbreak Pliers for cleaving small and large samples, thick and thin, 12”x9”(300mmx226mm) cleaving mat, and 8”/200mm with metric and inches L-square ruler (for use as a straight edge and to measure samples. Detailed Descriptions: 1. General purpose- TC-ND-STDH. Best general-purpose tungsten carbide cutter for glass, silicon and other crystalline materials. Cuts thin glass 0.3-1.5 mm and hard glass 0.3-6mm. 2. Laser Cutters. High penetrating, tungsten carbide cutting wheel, enables non-slip start and deeper scoring. 1. TC-ND-Laser- Cut glass 0.1-2 mm and hard glass 0.3-2mm. Trademarked Laser cutter excels at cutting thin glass, hard glass, quartz glass, silicon, and III-V substrates. 2. TC-ND-Laser-UT- Cuts Ultra-thin glass with “laser” wheel, 0.03-2 mm and hard glass 0.3-2mm. Trademarked Laser cutter excels at cutting thin glass, hard glass, quartz glass, silicon, and III-V substrates. 3. Cleanbreak Pliers 6” with spare set jaws. CWBR-100 Plier handle is 6” and jaw opening is.75”/19mm 4. Cleanbreak Pliers 8” with spare set jaws. CWBR-200 Plier handle is 8” and Jaw width 23 mm (.9") 5. Self healing cutting mat. 12”x9” inches on one side and metric on the other. 6. L shaped ruler – 8” with metric and inches Benefits: LatticeGear has sourced the best handheld tools in the world for cutting glass and crystalline substrates from very thin (0.03 mm) to 6 mm thick glass. These tools are designed for scribing glass and crystalline materials. Fewer particles are generated than pointed, diamond scribers as the scribe is generated by rolling a wheel embedded with tungsten carbide over the sample. Features: This kit comes complete with carbide cutting tools, cleaving pliers, cleaving mat and ruler. They will enable you cleave wide range of sample types from glass to GaAs.
CATEGORY
SKU :MC-FS-100 The patented FlipScribe® scribes without any touch to the top of the sample. It integrates a robust diamond scribe into a sample platform with a fence guide design (see the drawing below). Time required to align and scribe is about 1 minute. It allows users to accurately position the scribe mark relative to features on the front side, visualized either by eye or with a user-supplied high magnification microscope. FlipScribe® also offers a quick method for cleanly downsizing large samples, with a "scribe stope" to allow the operator to define the length of the scribe. FlipScribe® is a compact, stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab; no utilities required. Benefits - Enables accurate cleaving through frontside targets with a scribe made on the backside of the substrate - Scribe does not damage the frontside of the sample - Accuracy of scribe ±200 μm (achievable) - Flexible with respect to sample size and shape - Capable of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving - No maintenance required Features - Accurate positioning of the scribe relative to features on the front side (the front side being observed either by eye or with a stereoscope). - The length of the scribe can be varied from 1 mm to 100 mm - Prealigned diamond scribe in user replaceable cartridge; height and angle adjustable - Ruler embedded in platform enables precise and repeatable sample alignment and sizing - The tool is purely mechanical; no power required
CATEGORY
Accurate Indent and Cleaving System The addition of high magnification imaging enables accurate indenting resulting in samples cleaved with high accuracy.The LatticeAx® 225 delivers 20-μm accuracy with high quality cleaved surfaces in 5-min. It integrates the patented LatticeAx® base with an industrial platform customized for indenting and cleaving. The imaging package includes a focusing mount, a digital microscope with polarizer and real-time image acquisition and display software. With realtime imaging the indent is placed accurately with respect to the target making cleaving sample target simple and fast for all users. The 225 accepts samples with a wide range of sizes, thicknesses and materials. Benefits - ±20 microns cleaving accuracy - Accurate and Repeatable Indent and Cleave - Clean and high quality mirror finish cleaved face - Simple to operate - No maintenance contracts Features - All the features of the LatticeAx 120 base tool - Robust workstation platform designed for indenting and cleaving - USB2 digital microscope with realtime digital imaging interface - Microscope mount with fine focus control - Vacuum pump to secure sample with pneumatic valve switch Computer not included
CATEGORY
Base Indent and Cleaving System By using the Patented LatticeAx® base platform, every user can achieve high quality cleaves within 2 minutes for samples that vary in size, thickness and material. Use the 120 to cleave silicon, GaAs, glass, sapphire, hard disk drives and other substrates. With the LatticeAx® 120, you literally have in the palm of your hand a versatile and powerful cleaving tool for downsizing and cross sectioning a wide range of substrates including Silicon, GaAs, InP, Sapphire, Glass, and Hard Disk Drives. With the LatticeAx, you can cleave your samples as they are, without additional preparation, and strict rules on the size, shape, thickness, edge quality and material type. Benefits - Accurate and Repeatable Indent and Cleave - Clean and high quality mirror finish cleaved face - Simple to operate - No maintenance contracts Features - Small footprint (4"/100mm cube), easy to transport/move - Purely mechanical design, no power required to operate the tool - Diamond indenter with polished face for accurate positioning - Clock dial for indent calibration - Position control of indenter with 5 µm step size - Vacuum pump to secure sample with pnuematic valve switch
CATEGORY
