As the leading manufacturer of multicore fiber fanouts for more than 10 years, Chiral Photonics has been producing low-loss Multicore Fiber Fanouts (MCFFO) for fibers ranging from 2-22 cores. Our fanouts are both Telcordia and subsea qualified and can be produced to match any multicore fiber. Multicore Fiber Fanouts (MCFFO) enable addressing individual cores of multicore fibers with high precision and low loss. Due to the tight channel spacing in multicore fiber, addressing each core individually is challenging. Multicore Fiber Fanouts allow you to address each core and seamlessly integrate MCF with your existing single core fiber systems. Typical fanout specifications: - Average insertion loss per channel: <0.5 dB - Average crosstalk per channel: < -40 dB - Standard fanout package: ~60 mm length x 3.0 mm OD, including protective boots The multicore fiber (MCF) market currently lacks standardization, with each fiber manufacturer producing MCF based on their own specific application needs. Key variables include channel count, channel spacing, mode field diameter, lattice structures (hexagonal, square, circular, or custom), and wavelength parameters. We offer tailored solutions to meet your specific needs, including customizable MCF and single-mode (SM) pigtail lengths. Additional options include fiber ruggedization, jacketing, cabling, and connectorization. Fanouts can be customized and integrated with other components as required. Our fanouts are typically shipped as individual units to ensure detailed testing for insertion loss and crosstalk. However, paired configurations are also available upon request. We maintain a stock of various multicore fibers (refer to the MCF Table) and can supply both MCF and fanouts. We also have access to a number of other fibers, many not commercially available. If you prefer, we are also experienced in working with and creating fanouts for customer-supplied MCF. Let us help you find the right solution for your multicore fiber requirements.
The PSC611 is an all-glass, pump-signal combiner that offers: - Information loss of 0.5 dB or less on all channels - Polarization extinction ratio (PER) greater than 23 dB maintained through the signal channel - Flexible and scalable design, based on Chiral Photonics' proprietary pitch reducing optical fiber array (PROFA) technology, with independent control of channel spacing, mode field diameter, and channel count. Speak to us about your custom or OEM needs as this design facilitates use at 1060 nm as well as the shown 1550 nm configuration. The design can also be modified to suit your specific fiber needs: PARAMETER UNIT SPECIFICATION Signal Channel - Input Input Fiber Insertion Loss Return Loss PER 2 s dB dB dB SMF28 or PANDA 1550 1 <= 0.4 40 23 Pump Channels Number of Channels 1 Pump Fiber 1 Operating Wavelength Insertion Loss s s nm dB 6 105/125 pm core / cladding, NA: 0.12 800-1600 < 0.3 Dual Clad Fiber Output Fiber 1 Operating Wavelength 1 s nm 6/125/245 µm core / clad / clad2, Er:Yb-doped, NA: 0.18 / 0.46 1530-1625 Mechanical Specification Package Type 3 N C P None Connectorized Packaged (typical: 150 x 6 x 6 mm) - Speak to us about other wavelength requirements as this design can accommodate both Er (1550 nm) and Yb (1060 nm) bands. Please let us know your input, output and pump fiber requirements and we will work with you to adapt an existing design or optimize a new design to your combining needs. - Polarization extinction ratio, if PM fiber is used. - Standard package types that have been provided. Water-cooled package have also been provided. Please speak to us about your custom package and splicing needs.
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The PSC611-HP is a high power, all-glass, pump-signal combiner that offers: - Information loss of 0.5 dB or less on all channels - Compatibility optimized for the following fibers: - LMA 20/400 (NA: 0.065/0.46) double clad signal fiber - 200/240 (NA:0.22) pump fibers - Flexible and scalable design, based on Chiral Photonics' proprietary pitch reducing optical fiber array (PROFA) technology, with independent control of channel spacing, mode field diameter, and channel count. Speak to us about your custom or OEM needs. The combiner can, for example, be supplied pre-spliced to an active double-clad fiber of choice. The design can also be modified to suit your specific fiber needs. PARAMETER UNIT SPECIFICATION Signal Channel - Input Input Fiber Insertion Loss s dB LMA 20/400 (NA: 0.065/0.46) Dual Clad Fiber <= 0.4 Pump Channels Number of Channels Pump Fiber Operating Wavelength Insertion Loss s s nm dB 6 200/240 (NA: 0.22) 800-1600 < 0.2 Dual Clad Fiber Output Fiber Operating Wavelength s nm LMA 20/400 (NA: 0.065/0.46) Dual Clad Fiber 1060 - 1600 Mechanical Specification Package Type 1 P Packaged (typical: 150 x 6 x 6 mm) - Speak to us about other wavelength requirements as this design can accommodate both Er (1550 nm) and Yb (1060 nm) bands. Please let us know your input, output and pump fiber requirements and we will work with you to adapt an existing design or optimize a new design to your combining needs. - Polarization extinction ratio, if PM fiber is used. - Standard package types that have been provided. Water-cooled package have also been provided. Please speak to us about your custom package and splicing needs.
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Chiral Photonics is at the forefront of this technological advancement, providing MCF fanouts and related components that facilitate the seamless integration of these innovations into existing networks. Our submarine-qualified fanouts are currently in production, and we also offer a range of complementary components, including attenuators, wavelength division multiplexers, and other MCF amplifier components and assemblies. Our MCF fanouts and associated products are instrumental in supporting the evolution of submarine cable technology and ensuring its compatibility with current infrastructure.
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Additional products include customized high-density arrays and couplers, in-fiber linear and circular polarizers, high temperature sensors, evanescent couplers, fiber lasers and assemblies thereof. Chiral has also provided many R&D services, including packaging of photonic integrated circuits (PICs).
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