The future of semiconductor manufacturing Next Generation Packaging Solutions Brewer Science is revolutionizing packaging with innovative thin wafer handling (TWH) technologies. Our diverse set of high-performance materials allow for higher throughput, reduction in form factor, and lower cost. We work with leading equipment vendors to provide fully automated solutions for high-volume needs. Bonding Materials Debonding Technology Permanent Bonding Materials What is Wafer-Level Packaging? Wafer-level packaging (WLP) is the technology of packaging the die while it is still on the wafer—protective layers and electrical connections are added to the substrate before dicing. Originally, wafers were diced into individual chips, then packaged. Utilizing WLP technology allows chips to continue to reduce in size, streamlines manufacturing, and provides easier ways to test chip functionality. The Need for Temporary Bonding and Ultrathin Wafers To create new stacked designs, manufacturers must find ways to thin their device wafers before performing complex back-end processes. Using temporary bonding techniques, in which the wafer is attached to a stable carrier without disrupting back-end processes, can overcome this problem. Benefits of Ultrathin Wafers - Better heat dissipation - Form factor reduction - Increased performance - Decreased power consumption More than Moore Moore’s Law originally stated that the number of transistors would double every two years. However, the timeline has changed to 18 months. Moore’s Law has proven useful in the semiconductor industry as a way for companies to guide long-term planning and set targets in research and development. Since physical limitations to transistor scaling are being reached, moving beyond Moore’s Law has become a necessity. More-than-Moore Technology (MtM) focuses on creating new technological possibilities with unlimited application potential through research and development past already conventional methods. Benefits of MtM - Quicker time to market - Lower cost - Improved performance - Reduced size and space - More flexibility Brewer Science + Advanced Packaging Brewer Science has been using its materials expertise in the semiconductor industry to change the way the world looks at advanced packaging for over 15 years. With collaboration from our research, development, and applications groups we have become one of one of the largest advanced packaging knowledge centers in the world; creating the largest portfolio of products in the industry.
Temperature Sensor Arrays for FHE Applications Brewer Science can deliver highly sensitive, printed, metal temperature sensors for precise measurement of temperature on large areas and array applications. Temperature sensors can be used in a wide array of applications, enabling accurate, real-time responses to small changes in temperature. Our sensors provide full digital output with an onboard microcontroller for signal processing, have a flexible form factor, and can measure absolute temperature to within 1˚C. What Are RTDs? Resistive temperature detectors (RTDs) are devices that use resistance to show significant changes in temperature. These devices measure temperature by passing a low-level current through electrodes and measuring voltage drop across them. Why FHE Temperature Arrays? Flexible hybrid electronic (FHE) temperature arrays enhance many different applications and markets. Typically, users look for printed FHE systems when looking to measure temperature in confined spaces with narrow areas where typical silicon sensors can’t fit. FHE arrays are key for measuring multi-point surface temperature. Benefits of FHE Temperature Arrays - Full digital output with onboard microcontroller for signal processing - Flexible form factor - Measures absolute temperature to within 1˚C - Millisecond data capture for enhanced yield and throughput - Improves decision-making capabilities through real-time data collection - Easily interfaces to existing electronic systems to make fully printed temperature arrays for temperature monitoring in 2D surfaces - Able to be implemented into arrays for multi-point measurements, including different sensing technologies Potential Applications - Industrial tool optimization - Monitoring of electronic components - Environmental monitoring - Consumer applications - Batteries, displays, LEDs - Power supply - Electrical and hybrid vehicle batteries - Thermal mapping and imaging Specification Performance Parameters | Performance Resistance Value (at 25 ̊C) | 300 ± 10%Ω Accuracy: (-20˚C to +100˚C) | 0.6˚C Accuracy: (-40˚C to +120˚C) | 0.8˚C Operating Temperature | -40˚C to 120˚C Temperature sensors with higher operating temperature range (-50˚C, 250˚C) are also available When cycled from ambient to maximum temperature for a maximum 10 hours. We have found in our review of NIST standards for temperature sensors, drift at the upper temperature limit for an extended time (typically 10 hours)
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Temporary Bonding Material WaferBOND® HT-10.11 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment. WaferBOND® HT-10.11 material is an organic coating developed for temporary wafer bonding solutions for MEMS and 3-D wafer-level packaging applications. WaferBOND® HT-10.11 material enables effective bonding and support through substrate thinning and backside standard lithographic processing through the utilization of effective bonding and subsequent thermal slide, chemical, mechanical, or laser debonding for thickness < 75 μm. These materials were specifically developed for thin wafer handling (TWH), through-silicon via (TSV) reveal, and redistribution layer (RDL) creation or processes up to 250°C. Chemical release debond method requires a perforated carrier wafer or small die size if releasing after dicing Mechanical and laser debond methods require a compatible release material Wax Replacement WaferBOND® HT-10.11 material is an organic coating that enable back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment. This material is a great option as an alternative solution to typical wax adhesives. WaferBOND® HT-10.11 material offers significant advantages because it can be applied with a one-coat process, improve throughput, simplify cleaning, and shorten processing time. Properties | Wax | WaferBOND® HT-10.11 Material Thickness Range | ~ 10 – 35 µm | 20 µm – 130 µm Coating Throughput | Requires multiple coats | Single-coat process Bonding Temperature Range | 95°C – 110°C | 130°C – 180°C Debonding Temperature Range | 95°C – 110°C | 150°C – 200°C Thermal Stability Temperature Range | < 120°C | ≤ 250°C Benefits - Enables ultrathin wafer processing utilizing standard BEOL techniques and tooling - Assists in creation of interconnects (RDL layers) after thinning - Protect devices from chemical degradation and physical breakage - Adhesive materials can be completely removed from device wafer without damage - Can be utilized with various debond methods (chemical release, thermal slide, mechanical, or laser) Debond Methods WaferBOND® HT-10.11 material is compatible with the following debond methods: - Chemical Release System - Laser Release System - Mechanical Release System - Thermal Slide Release System With this WaferBOND® material, you can: - Process ultrathin wafers in temperatures up to 250°C - Protect the wafer edge from chipping - Protect circuitry from harsh chemical etchants - Provide a void-free interface for a smooth surface on the final thinned wafer WaferBOND® HT-10.11 Material Spin Speed Curve:
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Real-time Water Quality Sensors Expect More From Your Water Real-time Water Quality Sensing Customized water sensor systems and devices, combined with unique materials and designs, enable viable resource monitoring for enhanced quality of life. Water quality sensors can be used in a wide array of applications such as water quality monitoring, resource optimization, and environmental monitoring. Our sensors provide full digital output with an onboard microcontroller for signal processing and can measure analytes such as lead, nitrates, conductivity, and pH. Current Methods are Slow and Cumbersome Today, water samples are collected manually and tested at a laboratory. Wait times for results are typically measured in weeks or longer. Testing systems are not modular, requiring multiple systems to test for additional parameters. All of this labor, time, and equipment increase the cost significantly. Brewer Science InFlect® water quality sensor systems offer enhanced efficiency and a simplified solution compared to current methods. Benefits - Arrays for multi-point measurements, including different sensing technologies - Improves decision-making capabilities through real-time data collection - Simple operation; automated sensing delivers results without manual input - Adaptive design for applications across many industries - Millisecond data capture for enhanced yield and throughput - Full digital output with onboard microcontroller for signal processing Applications - Water quality monitoring - Resource optimization - Condition monitoring - Process optimization - Environmental monitoring Detection Ranges Parameter | Range Lead (Pb 2+) | 1 to 10,000 ppb Nitrate (NO 3–) | 1 to 100 ppm Temperature | 1˚C to 40˚C pH | 4.5 to 10.5
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OptiStack® multilayer systems are our flagship lithography technology, and are used for leading-edge high volume IC manufacturing. OptiStack® multilayer lithography systems are designed for the most advanced high-volume semiconductor manufacturing processes in the world. Our versatile OptiStack® material set is designed to be used in combination with our proprietary optical modeling to achieve the finest resolutions possible with 193-nm immersion lithography. The OptiStack® system advantage - A universal substrate – OptiStack® materials work together to planarize a wide range of topography, effectively creating a "universal substrate" for advanced processes. - Superior optical performance – OptiStack® modeling systems work with unique paramaters to yield superior pattern fidelity to that of standard modeling systems. - High aspect ratio capabilities – OptiStack® materials maintain excellent pattern fidelity even at extreme aspect ratios. How OptiStack® multilayer systems work OptiStack® multilayer systems use a combination of a thick, carbon-rich underlayer, a thin silicon hardmask, and a thin photoresist to achieve accurate pattern transfer to the substrate. Some scenarios also require an additional bottom anti-reflective coating (BARC) beneath the photoresist. After the thin photoresist is imaged, the pattern is transferred to the silicon hard mask (Si-HM, also known as a spin-on glass or SOG) using a highly selective etching process, such as fluorinated plasma. The pattern is then transferred to the carbon-rich underlayer (known as a spin-on carbon or SOC) with another selective etching process, typically an oxygen-rich plasma. The imaged hardmask and SOC layers can then be used to transfer the pattern to the substrate. Why we need multilayer lithography systems Immersion lithography requires the photoresist to be extremely thin due to the shallow depth of focus inherent in high-NA optical systems. At these thicknesses, the photoresist can no longer survive the etching steps required to transfer the pattern into the substrate. The additional materials in a multilayer stack essentially work to magnify the etch resistance of the photoresist.
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