By Aurigin Technology Pte Ltd.
Fully-automatic FCBGA ball mounter for carrier-based devices Key features - Fine pitch: ball sizes down to 0.2mm diameter - Large panel carrier: up to 160 x 310 mm - Precise handling: proprietary design eliminates solder sphere damage - Quick setup: rapid product change-over with quick-change product tooling - Supports digital protocols: SECS/GEM200, GEM300 Standard
Fully-automatic BGA ball mounter for substrate-based packages Key features Sphere size: handles small sphere sizes down to 0.13mm diameter Precise handling: proprietary design eliminates solder sphere damage Quick setup: rapid product change-over with quick-change product tooling Supports digital protocols: SECS/GEM200, GEM300 Standard
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Fully-automatic solder ball rework system. Key features: Smart rework system: for substrates, compatible with au800 series. Multiple defect handling: e.g. missing ball, extra ball, offset error. Automated and high UPH. Supports digital protocols: SECS/GEM200, GEM300 Standard.
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Fully-automatic boat-to-tray sorter offloader system Key features Automated offloader: for FCBGA devices, compatible with au901c Supports digital protocols: SECS/GEM200, GEM300 Standard
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