By Technoprobe
Fully Automated Probe Card Analyzer Redefining performance in Probe Card analyzing Athena is a new generation metrology tool designed to perform better POR optical, mechanical, and electrical measurements on Probe Cards. 3x faster optical alignment Flying probe loopback 6 µm V-align spec 600 kg force 3x faster wire check Optical planarity measurement Highlights - High-precision optical probe position measurement in X, Y, and Z including planarity - Fine-pitch probe measurement, as low as 25 µm - Multiple probe types in single array - Flexible, feature-rich vision system for wide variety of probe types - Probe tip 3D morphology - Probe free-tip-length measurement - High channel count: 9216 - Loaded and unloaded electrical planarity measurement - DC loopback testing - Board-only testing - Contact resistance stability across multiple probe tip metallurgies - High-frequency testing (AC loopback) - High array force up to 600 kg - Full-wafer 12’’/300 mm - Closed-loop stages with 0.01 μm encoders - High accuracy and stability: demonstrated tool-to-tool correlation across fleet - Interchangeable interface design: compatible for probecards of any tester platform (V93k, Ultraflex, HDMT…) - Fully automated: choose any suite of tests - Test data analytics - Option: multiple-probecard autoloader, or debug station Measurement capabilities Optical alignment by 3D inspection system (WLI, white light interferometer) Unloaded electrical planarity by post Loaded electrical planarity by plate Contact resistor versus conductive plate Leakage at overtravel and without load Test of capacitors value in farad Test of resistors value in ohm Electrical continuity check and path resistance measurement on loopbacks within ST or PCB Capacitor leakage at overtravel and without load Probe Card load in overtravel Measurement | Athena Capability (σ) | Comparison to Legacy Analyzer Optical Alignment @WLI | X/Y = 0.16 um | 2x better Z = 0.15 um | N/A LEP@Plate | 0.3 um | 2.75x better Cres@Plate | 0.005 Ohm | 5x better Array Force | 0.25 kg | N/A Performance benchmark Measurement | Athena Acquisition time | Legacy Acquisition time Optical Alignment @WLI | 90 min | 240 min Cres@Plate | 90 sec | 15 min Leak@Free | 3 min | 5 min CAP | 4 min | 20 min UEP | > 7 p/sec | 2 p/sec Throughput benchmark
Probe cards are hi-tech devices for testing the functioning of chips during their construction process. A probe card is an electromechanical interface that allows testing the functioning of a chip when it is still on the wafer or before it is individually packaged. The probe card makes contact with the pads or bumps of the chips. Once it has made contact with the chip, the probe card connects it electrically to the tester which checks the functionality of the chip. Each probe card is custom made for the chip to be tested. They are highly technological devices. Probe cards can have more than 50,000 contacts and the distance between them can be as small as 40µm (4 hundredths of a millimetre).
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Enables deep debug on Probe Cards and 100% tests. Compatible with legacy motherboards.
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Ideal for HVM throughput, enables statistical data collection on several Probe Cards.
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FusionLink is an advanced interface solution architecture aimed at revolutionizing what is possible in test. FusionLink combines the best-in-class design and manufacturing technologies & processes available to allow your interface solution to be optimized for your specific testing requirements and achieve higher power densities, faster signal delivery, and reliable on-time deliveries. The FusionLink architecture is able to benefit both Probe Cards and Final Test Boards. It is the result of years of cross-functional research and development finalized with the acquisition of DIS Tech. With this combined expertise, Technoprobe and DIS Tech introduce FusionLink as the most sophisticated and efficient interface solution to address the increasingly challenging electrical and mechanical needs of the test market and delivering unparalleled value in both wafer level and final test. Technoprobe will utilize the FusionLink architecture for next generation advanced Probe Cards. DIS Tech will develop and offer the most advanced Final Test Interface boards available using this same architecture. FusionLink integrates advanced technologies found in semiconductor packaging along with advanced materials. It also extends into new innovations in the design process to achieve best-in-class results in a shorter lead time. This is complemented with new technologies to support fabrication, assembly, and verification that result in a fully functional product which the customer can utilize when it arrives. We have fundamentally re-engineered the entire development cycle in creating FusionLink. FusionLink unlocks performance & quality gains that will improve customers’ manufacturing efficiency while accelerating time to market. We engineered FusionLink to enable our customers get the best performance, highest quality and most especially a faster time to market. Customers have had to compromise on one or more of those key points for too long. FusionLink means they can finally get the interfaces they want and need from a partner they can trust.
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