The vacuum chuck features automated lift-pins for gentle wafer handling and precise three-point alignment for bow and warp measurements. It is also available for wafers on a frame and in additional configurations.
Resolution: down to 50 nm Speed: up to 36 million datapoints /sec Features: Interchangeable sensor heads Linesensor 2 Measuring rate: 7.9 – 18.3 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 600 680 µm 9.2 mm 50 nm +/- 50° 2.36 mm 1.97 µm L-CHR2 2500 2500 µm 27 mm 200 nm +/- 33° 4.40 mm 3.69 µm L-CHR2 10000 10600 µm 36.6 mm 800 nm +/- 13° 11.9 mm 9.90 µm Linesensor 2 Pro Measuring rate: 7.9 – 36 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 1250 Pro 1250 µm 13 mm 100 nm +/- 45° 4.50 mm 3.75 µm L-CHR2 2400 Pro 2400 µm 21.4 mm 200 nm +/- 38° 8 mm 6.67 µm L-CHR2 3000 Pro 3000 µm 40 mm 250 nm +/- 15° 20 mm 16.67 µm L-CHR2 5000 Pro 5000 µm 42 mm 400 nm +/- 25° 11.9 mm 9.92 µm
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For high-resolution lateral measurements Resolution: up to 235 MP Speed: up to 72 fps Available Models Camera Type Camera Type Color Native Resolution Maximum Resolution (Pixel Shift) Frame Rate 235M Monochrome 5120 x 5120 15360 x 15360 px 72 fps (8 fps for maximum resolution) 235C RGB 5120 x 5120 5120 x 5120 px (True Color) 72 fps (8 fps for true color mode) Objective Objecive Working Distance Magnification Field of View Aperture Lateral Resolution Xenon-Sapphire 110 mm -1.53 15 x 15 mm² 0.09 0.98 – 2.9 µm Working Principle This advanced measurement technology offers precise distance measurements using a polychromatic light source. Pixel Shifting Pixel shifting boosts resolution beyond sensor limits by capturing multiple shifted images. High Resolution The VWC-235M achieves 235 MP in black and white, while the VWC-235C captures high-resolution color by recording separate RGB values for each pixel.
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Production software for a fully automated metrology process. Management for Metrology Systems. M-Link is our software for controlling handling and multiple metrology systems. Operator-friendly and easily integrated into production environments through SECS/GEM. Key Features: Overview at a glance - Get a real-time view on handling, systems, magazines, measurements and results. Touch screen optimized - Full touch control designed for cleanroom environments. Production ready - SECS/GEM integration for seamless connection to your production environment. ASCAN remote control - Use M-Link to control ASCAN automation software, optimized for full-scale production environments.
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High-Throughput Wafer Metrology Measurement and Analysis Modes Fully Automated including Handling Measurement Area up to 2x 250 x 250 mm² single or double-sided Use-Case Examples Step Height, Flatness (Bow, Warpage), Coplanarity (Bumps, Plugs), Thin Film, Lasermarks and many more Fully Automated Metrology Cell The AL 200D integrates two dockable CT 300 or CT 350T units with a wafer handling system, supporting wafers from 4” to 8”. This design maximizes throughput and can be used for a wide range of front-end applications.
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