Optical CD platform for high productivity and high-performance metrology Nova VeloCD® is an advanced standalone dimensional metrology platform, optimized for high productivity in a wide range of Logic and Memory applications. It features state-of-the-art metrology and handling hardware, together with a suite of advanced modeling and machine learning algorithms, to offer optimal metrology performance. Highlights and Benefits Unmatched Throughput Dual measurement units enable rapid multi-site measurement per wafer, delivering best-in-class throughput for high sampling rates High Availability A low-maintenance high-brightness light source, together with a highly robust handling system, boosts uptime while reducing platform maintenance frequency and associated costs Enhanced Metrology An extended wavelength range with improved SNR enables high-precision metrology with improved budget time and repeatability Industry Leading ML Comprehensive advanced modeling tools allow a shorter time to solution (days to hours) and enable precise and accurate metrology with Stack-maker and Nova Swift Why Nova VeloCD®? The Nova VeloCD® is a cutting-edge standalone dimensional metrology platform designed for Advanced Logic and Memory applications. It integrates advanced metrology and handling hardware with sophisticated modeling and machine learning algorithms, ensuring optimal performance. Key features include dual parallel measurement units for high throughput, a low-maintenance bright light source for high availability, and an extended wavelength range for enhanced precision. Finally, Nova VeloCD® offers industry leading machine learning modeling tools that significantly reduce the time to solution and enable precise and reliable metrology.
Next-generation solution for fast, high-precision inline XPS and XRF materials metrology Revolutionizing inline materials metrology, the Nova VeraFlex® LE-XRF product line is the industry standard for combined XPS and low energy XRF (LE-XRF) materials characterization. The most recent addition to the product line, Nova VeraFlex® IV LE-XRF addresses critical industry challenges across all device market segments. Higher precision and throughput are achieved by significantly increasing X-ray flux at the measurement site and integrating complementary machine learning solutions, enabling this next-generation platform to further strengthen the market leadership of the Nova VeraFlex® LE-XRF product line. Highlights and Benefits Higher Flux - System enhancements have been developed for increasing X-ray flux that generates higher photoelectron count rates and faster processing. This offers substantial throughput improvements while maintaining precise measurement performance. Measurements Where You Need It - Designed with enhanced X-ray beam alignment and control for smaller next-generation pad sizes, in-line measurements can be taken both in the scribe line and in-die on-device. XPS/XRF Sensitivity - Both XPS and LE-XRF measurements can occur simultaneously for inline and in-die applications, offering unique metrology solutions for critical yield-driving applications. Automated Health Check - Beam parameters from the electron gun and the generated X-ray beam energy are continuously monitored enabling uninterrupted high-volume manufacturing. Machine Learning - Machine learning capabilities enhancing the throughput and precision performance of new or established applications and maximize system productivity. Why VeraFlex® IV LE-XRF New material integration strategies continue to drive critical device performance improvements for advanced FinFet, Nanosheets, and novel memory structures. The VeraFlex IV LE-XRF provides the highest X-ray flux available to deliver the speed, sensitivity, and flexibility necessary to enable these performance breakthroughs.
CATEGORY
Advanced performance IM solution Nova i550® is a cutting-edge integrated metrology platform that provides superior metrology performance for CMP and etch process control in the most advanced logic and memory technology nodes Highlights and Benefits 01 Best Metrology Performance 02 Direct Device Measurements 03 Highest Productivity Best Metrology Performance Unique hardware and modeling capabilities that enable enhanced metrology performance Direct Device Measurements Measures logic and memory in-die structures, including complex 1D, 2D, 3D and direct devices Highest Productivity Faster throughput delivers better productivity Why Nova i550®? Nova i550® is designed to meet the process control challenges of the most advanced R&D developments and production lines. With new optics providing wider spectral information, a smaller pad size, and advanced pattern recognition to optimally support unique modeling algorithms, Nova i550® offers the industry’s highest metrology accuracy, precision and tool matching capabilities. Working in conjunction with the Nova MARS software application development platform, Nova i550® delivers advanced process control for the most advanced logic, 3D NAND double-deck structure, and advanced DRAM applications. Addressing the need for high-performance metrology closer to the process, Nova i550® significantly boosts productivity. Qualified for integration with leading vendors’ CMP and etch process equipment, the solution enables high sampling and multi-site measurement schemes. When supported by Nova’s central management, control and connectivity suite, Nova i550® offers even greater operational efficiency and advanced metrology control functionality.
CATEGORY
High-productivity metrology platform Nova T500® is a high-productivity metrology platform designed to address the unique challenges of the semiconductor manufacturing industry. The powerful platform delivers increased sampling rates and advanced metrology capabilities. Highlights and Benefits Industry Standard, Field Proven Platform Sets the industry standard for CMP process control, with thousands of deployments and proven reliability at customer sites, with optional field upgrades to further increase productivity Outstanding Performance Best-in-class accuracy, repeatability and tool-to-tool performance 100% Compatible to Nova i500® Utilizing the same design Engineering Station Supporting IM Product Line Used for recipe creation and as a redundancy tool that enables Pre/ Post measurement for additional sites and data collection Why Nova T500®? Nova T500® helps manufacturers meet the growing need for high productivity in advanced semiconductor manufacturing. Featuring the same optical design and having full commonality with the Nova i500® integrated metrology platform, Nova T500® completes the company’s unique, highly efficient CMP metrology and process control offering. As part of Nova’s fleet solution for semiconductor manufacturers, Nova T500® is qualified to support a broad range of tools, including Nova i500®, and is available in multiple configurations. When supported by Nova’s central management, control and connectivity suite, Nova T500® platform enhances operational efficiency and advanced metrology control functionality.
CATEGORY
Nova Metrion® leverages secondary ion mass spectrometry (SIMS) technology to provide information that no other inline metrology system can deliver. This includes direct, inline measurement of chemical composition at high depth resolution and data density, as well as simultaneous measurement of multiple species throughout a 300mm wafer’s film stack. Process automation with built-in film analysis and recipe management makes the Nova Metrion® system easy to use, while performing these measurements in the production fab shortens time to results. Highlights and Benefits Direct Composition Profiling Directly measures compositional profiles inline at high depth resolution and data density Built-in Film Analysis Simplifies measurements and accelerates process insight with built-in film analysis and recipe management Full Factory Automation Supports full factory automation to enable high-volume manufacturing Contamination Free Ensures worry-free use within contaminant-sensitive production environments Whole Wafer Measurements Eliminates sample preparation and enables multi-point measurements for wafer uniformity mapping Reduced Scrap and Enhanced Yield Faster time to results reduces scrap and improves yield to deliver fast return on investment (ROI) Why Inline SIMS? Delivering time-sensitive information needed to monitor and control high-volume manufacturing (HVM) workflows, inline SIMS prevents scrap, reduces rework,and enables tighter statistical process control (SPC).
CATEGORY
