We offer both automated and semi-automated resist processing tools, suitable for high volume manufacturing as well as R&D work. Highlights Suitable for R&D Avaliable both as open bowl or with Obducat’s patented Rotating Covered Chuck Technology (RCCT) enabelling excellent coating uniformity on square/ rectangular and irregular shaped substrates Process modules are the same as in HVM tools - enables easy migration to volume production Industry leading customization level possible for specific customer needs Features Obducat’s highly appreciated QS platform provides the perfect semi-automatic solution for current and future R&D as well as pilot manufacturing requirements The systems can handle substrate sizes up to 300 mm Ø or 9”x 9” Also available as Large Substrate model capable of handling substrates up to 1400 mm Ø or 1000 x1000 mm
Fully automated coater and developer The Microcluster tool is available in 200- or 300-mm versions and is a fully automated cassette-to-cassette coater developer. The Microcluster tool is configured with four modules and offers high flexibility and represents the ideal configuration for R&D and pilot production needs meeting industry requirements with excellent uniformity and process repeatability..
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Fully automated wet processing Track tools The Microcluster WET Track tools are available in 200-, 300- or up to 1500 mm versions and are fully automated cassette-to-cassette wet processing solutions. The Microcluster WET tools are configured with five modules or more which can be dedicated to performing cleaning-, lift-off-, etching- or developing processes. The Microcluster WET Track tools offers a high level of versatility and adaptability which makes it very suitable for High Volume Manufacturing needs meeting industry requirements with superior uptime, process repeatability, high yield and competitive Cost-of-Ownership.
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Obducat’s revolutionary Rotating Covered Chuck Technology (RCCT™) process environment design provides for: - A completely sealed solvent saturated atmosphere - Minimal turbulence around the substrate eliminating rotational corner effects on squared substrates, enabling industry leading uniformity across the entire substrate at lower spin speeds. - Superior coating uniformity on submicron layers as well as for thick resist layers compared to open bowl. - Reduced process cost and improved environmental profile by lowering material consumption. - Elimination of Backside Rinse (BSR).
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