By Nanovac AB
As with our thermal vacuum test chambers, we provide a range of custom solutions for physical vapor deposition systems, again, building solutions based on very specific customer requirements. We provide solutions based on resistive evaporation, e-beam evaporation as well as sputter deposition (DC and RF). The common denominator for all our system solutions is a small footprint, competitively priced, and with low cost-of-ownership. We manufacture a range of turn-key solutions, including... physical vapor deposition systems (PVD) including evaporation and sputtering solutions.
The R&D system, PVD-2-RS is our low cost PVD system, utilizing two resistive sources for deposition.
CATEGORY
We also manufacture and design custom PVD (physical vapor deposition) systems for demanding thinfilm R&D applications.
CATEGORY
We are also manufacturing reverse engineered consumable parts for plasma etch and deposition systems.
CATEGORY
Horizontally loaded thermal vacuum test chambers allows for horizontal loading of the DUT (device under test). Our solutions are to a large extent custom designed, as dimensions of the DUT many times drive the size of the chambers. Inner diameters typically range from 500mm in diameter up to several meters depending on the enduser test requirements. We can deliver with hinged doors in both the front and rear of the chamber, alternatively having only one end with a door. The door can be left or right hinged, or mounted on a sliding mechanism. By default the thermal test plate is installed on a sliding rail mechanism to simplify loading/unloading and setup of the test campaign.
CATEGORY
