The first acid decapsulator made for copper. The Elite Etch Cu 7100 improves upon the design of the Elite Etch 7000 by incorporating a rapid heating and cooling system. Using a thermal exchanger directly contacting the etch head and acid lines, sulfuric acid decapsulation rate is accelerated to reduce overall volume usage. A precise acid temperature combined with a high delivery rate allows decapsulation of copper wired devices without causing damage to the metallized wires. The specially designed acid heat exchanger can accurately control the acid temperature between 10° and 250° C with flow rates of up to 8 ml per minute. The high acid pulse rates allow for reasonable etch times even at the lowest temperatures. The Elite Etch Cu features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process, both for operator safety and convenient acid disposal. The device hold-down assembly (ram nose) is a pneumatically activated push rod. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose secures the sample package and a definition gasket to the etch head, thus eliminating movement of either the package or its fixturing. RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid. Specifications Etcher Unit Height: 300 mm (13 in) Etcher Unit Width: 190 mm (7.5 in) Etcher Unit Depth: 305 mm (12 in) Bottle Assembly Height: 254 mm (10 in) Bottle Assembly Width: 280 mm (11 in) Bottle Assembly Depth: 127 mm (5 in) Weight: Approx. 16 kg (35 lb) Power Source: 90 to 250 VAC, 50 to 60 Hz (4 amp) Acid temp. range: 10° to 250° C Acid temp. set point: 1° C ± 1% of setting Etch cavity (up to): 22 mm x 22 mm (30 mm diagonal) Choice of Acids: fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid Acid Mix Ratios (nitric to sulfuric ratios): 9:1, 6:1, 5:1, 4:1, 7:2, 3:1, 5:2, 2:1, 3:2, 1:1, 1:2, 1:3, 1:4, 1:5 Post Etch Rinse Options: sulfuric acids, fuming nitric acids, mixed acids, or no rinse Etch Times: 1 to 2,400 seconds in 1 second increments (1 seconds to 40 minutes) dynamic (real time) adjustments of etch time Etchant Volume Selection: 1 to 8 ml per minute - for all acids & acid mixes Etch Delivery Functions: pulsed or Reciprocal Etch Acid Pulse (REAP) for lower acid consumption Operator Program Storage: 100 programs stored to nonvolatile memory Warranty: most comprehensive and inclusive warranty in industry (ask for full details) Dual Acid Decapsulation Mix Ratios Settings Touchscreen Interface Bottle Box Included Silicon Protective Aluminum Protective Gold Protective Rapid Cooling System Copper Protective Silver Compatability (With I53 Injector Accessory)
The Mega Etch includes the same functionality of all other RKD Engineering decapsulator models with additional features. It operates at temperatures up to 250° C enabling operational versatility with any combination of acids. This model improves upon the design of the Elite Etch series with an expanded decapsulation chamber and ESD mitigation. The expanded space surrounding the etch head allows a complete PCB to be prepared for failure analysis by using a gasket stack up with correct definitions cut. The Mega Etch can accommodate a PCB up to 152.5 x 152.5 mm (6 x 6 in). The Mega Etch features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process, both for operator safety and convenient acid disposal. The IC is held in place by a pneumatically activated push rod called the ram nose. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose ensures that the IC package and a definition gasket are secured to the etch head, thus eliminating movement of either the package or its fixturing. The ram nose is connected to a high impedance resistor network to further aid in ESD mitigation during decapsulation. The use of an electrically isolated, yet dissipative ram nose assembly prevents ESD problems within the circuitry being exposed. RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid. To mitigate ESD problems when handling decapsulated packages on a board, including removal of the board from the decapsulator, rinsing, drying etc. The Mega Etch system is equipped with two ESD panel mounted sockets and circuitry for the attachment of ESD tweezers and a wrist strap. The unit however may be operated without appropriate grounding. Specifications Etcher Unit Height: 431 mm (17 in) Width: 330 mm (13 in) Depth: 483 mm (19 in) Bottle Assembly Height: 254 mm (10 in) Width: 280 mm (11 in) Depth: 127 mm (5 in) Weight: Approx. 18 kg (40 lb) Power Source: 90 to 250 VAC, 50 to 60 Hz (4 amp) Acid temp. range: 10° to 250° C Acid temp. set point: 1° C ± 1% of setting Etch cavity (up to): 22 mm x 22 mm (30 mm diagonal) for any packages mounted on or off a PCB. Maximum board size is 152.5 x 152.5 mm (6 x 6 in) Choice of Acids: fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid Acid Mix Ratios (nitric to sulfuric ratios): 9:1, 6:1, 5:1, 4:1, 7:2, 3:1, 5:2, 2:1, 3:2, 1:1, 1:2, 1:3, 1:4, 1:5 Post Etch Rinse Options: sulfuric acids, fuming nitric acids, mixed acids, or no rinse Etch Times: 1 to 2,400 seconds in 1 second increments (1 seconds to 40 minutes) dynamic (real time) adjustments of etch time Etch Modalities: Pulse Etch, Reciprocal Etch Acid Pulse (REAP) Temperature Ranges: 10° to 90° C (nitric acid), 20° to 250° C (sulfuric acid), 10° to 100° C (mixed acids) Etchant Volume Selection: 1 to 8 ml per minute - for all acids & acid mixes at a temperature above 100° C Operator Program Storage: 100 programs stored to nonvolatile memory Ambient Temperature Range: 15° to 26° C Warranty: most comprehensive and inclusive warranty in industry (ask for full details) Included features: Dual Acid Decapsulation, Mix Ratios Settings, Touchscreen Interface, Bottle Box Included, Silicon Protective, Aluminum Protective, Gold Protective, Rapid Cooling System, Copper Protective, Silver Compatability, ESD Mitigation Control, Direct Large Board Decapsulation
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The first-generation automated mixed acid decapsulator RKD Engineering's Elite Etch incorporates the latest innovations. The etch head is machined from premium grade silicon carbide for its extreme acid and temperature resistance. Coupled with an active nitrogen gas monitoring and purge system, this monolithic design to reduces the fuming of residual acids left on the etch head after each decapsulation process. The silicon carbide etch head enables short heat-up times with high thermal conductivity. The device hold-down assembly (ram nose) is a pneumatically activated and is designed for a large amount of travel. The ram nose only extends when the safety cover is fully closed to ensure absolute vertical movement. The ram nose secures the sample to the etch head, thus eliminating movement of either the package or its fixturing. The safety cover is operated manually for safe control of the operation. This guarantees to the operator that the cover has sealed correctly. Acid flow lines and system assemblies are radially symmetrical compression joints which are engineered to eliminate high pressure seal failures. The Elite Etch is designed to fit comfortably inside of a fume hood while maintaining all necessary safety features. By using a heat exchange system, waste acid is cooled below 90 C to allow the use of a single waste bottle. The Elite Etch uses 3 standard 500 ml bottles which are supplied with the system. RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchanges. Specifications Etcher Unit Height: 300 mm (13 in) Width: 190 mm (7.5 in) Depth: 305 mm (12 in) Bottle Assembly Height: 254 mm (10 in) Width: 280 mm (11 in) Depth: 127 mm (5 in) Weight: Approx. 16 kg (35 lb) Power Source: 90 to 250 VAC, 50 to 60 Hz (4 amp) Acid temp. range: 20° to 250° C Acid temp. set point: 1° C ± 1% of setting Etch cavity (up to): 22 mm x 22 mm (30 mm diagonal) Choice of Acids: fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid Acid Mix Ratios: (nitric to sulfuric ratios) 9:1, 5:1, 4:1, 3:1, 2:1, 1:1 Post Etch Rinse Options: sulfuric acids, fuming nitric acids, mixed acids, or no rinse Etch Times: 1 to 1,800 seconds in 1 second increments (1 seconds to 30 minutes) dynamic (real time) adjustments of etch time Etch Temperature Ranges: 20° to 90° C (nitric acid), 20° to 250° C (sulfuric acid), 20° to 100° C (mixed acids) Etchant Volume Selection: 1 to 6 ml per minute - for all acids & acid mixes Operator Program Storage: 100 programs stored to nonvolatile memory Basic Model: Elite Etch 7000 Dual Acid Decapsulation: ✔ Mix Ratios Settings: ✔ Touchscreen Interface: ✔ Bottle Box Included: ✔ Silicon Protective: ✔ Aluminum Protective: ✔ Gold Protective: ✔
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Fully featured decapsulation with ESD mitigation The Elite Etch Cu ESD 7200 model incorporates critical ESD protection circuitry, thereby eliminating the potential for incremental ESD damage to fragile packages during decapsulation. In traditional non-conductive PTFE, a charge may build up on the inner surface of the acid line tubing and any residual electrical charge cannot be neutralized. If the charge exceeds the dielectric strength of the PTFE, dielectric breakdown occurs. ESD hazards associated with PTFE are eliminated in this system by the use of electrically dissipative PTFE. The Elite Etch Cu ESD 7200 is equipped with a conductive ram nose connected to a high impedance resistor network to aid in ESD mitigation during decapsulation. The plastic encapsulated IC itself is of particular concern to justify working with a static-free environment. The solution is an electrically isolated yet dissipative ram nose assembly combined with the electrically functional PTFE. These components ensure that the process of decapsulation eliminates all ESD risks within the part being opened. The system is equipped with two ESD panel mounted sockets and circuitry for the attachment of ESD tweezers and a wrist strap. The wrist strap can be worn to mitigate ESD problems when handling a decapsulated package- including removal of the part from the decapsulator, rinsing, or drying. Specifications Etcher Unit - Height: 300 mm (13 in); Width: 190 mm (7.5 in); Depth: 305 mm (12 in) Bottle Assembly - Height: 254 mm (10 in); Width: 280 mm (11 in); Depth: 127 mm (5 in) Weight - Approx. 16 kg (35 lb) Power Source - 90 to 250 VAC, 50 to 60 Hz (4 amp) Acid temp. range - 10° to 250° C Acid temp. set point - 1° C ± 1% of setting Etch cavity (up to) - 22 mm x 22 mm (30 mm diagonal) Choice of Acids - fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid Acid Mix Ratios - (nitric to sulfuric ratios) 9:1, 6:1, 5:1, 4:1, 7:2, 3:1, 5:2, 2:1, 3:2, 1:1, 1:2, 1:3, 1:4, 1:5 Post Etch Rinse Options - sulfuric acids, fuming nitric acids, mixed acids, or no rinse Etch Times - 1 to 2,400 seconds in 1 second increments (1 seconds to 40 minutes) dynamic (real time) adjustments of etch time Etchant Volume Selection - 1 to 8 ml per minute - for all acids & acid mixes Etch Delivery Functions - pulsed or Reciprocal Etch Acid Pulse (REAP) for lower acid consumption Operator Program Storage - 100 programs stored to nonvolatile memory Ambient Temperature Range - 15° to 26° C Ambient Humidity - 0 to 70% non-condensing Warranty - most comprehensive and inclusive warranty in industry (ask for full details) Dual Acid Decapsulation Mix Ratios Settings Touchscreen Interface Bottle Box Included Silicon Protective Aluminum Protective Gold Protective Rapid Cooling System Copper Protective Silver Compatability ESD Mitigation Control (ESD Control Included)
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RKD Engineering’s Mount Plate is a unique hot plate used for mounting integrated circuit packages with special wax. Packages are mounted in preparation for precavitation, heat spread/sink removals, specialized mechanical preparations and other typical usages for high temperature heating. Mounting IC Packages for Sample Preparation The Mount Plate heats the metal holding fixture at a programmable rate to prevent thermal damage to the sample being mounted. When the melting point of the wax is reached, the operator is prompted to mount and align the sample. The device then cools the holding fixture at a controlled rate, setting the mounting wax. When the sample is cooled to an ambient temperature, the operator is prompted to remove the mounted device and holder. The Mount Plate 5800 allows fast and accurate sample mounting. It receives standard RKD Engineering part holding fixtures and can be operated under a microscope for precision part alignment. Features: - Accurately controlled sample temperature - Controlled heating rate to minimize thermal stresses - Controlled cooling rate - Fast cycling - Easy to use operator interface - Special cycle for manual acid decapsulation - Low profile - can be placed under a microscope Specifications Dimensions: Height: 133 mm (5.25 in); Width: 165 mm (6.5 in); Depth: 280 mm (11 in) Weight: Approx. 3 kg (7 lb) Power Source: 90 to 250 VAC, 50 to 60 Hz (4 amp) Temperature Range: 30° to 140° C Heating Up Rate: 0.1° to 0.8° C/s Cooling Down Rate: 0.1° to 0.8° C/s Soak Time: 1 to 60 s Rest Temperature: 30° C nominal Temperature Accuracy: +/- 1° C Downloads Brochure Spec Sheet
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