By Loadpoint
Applications Wafer dicing to singulate die such as computer processors, chips, other etched devices Process targets Process and blade optimisation to ensure the highest productivity and lowest cost without sacrificing cut quality, continuous improvement of work holding materials and chucks to minimise top and bottom surface chipping, protection of special coatings or fine MEMS structures, maintaining accurate cutting tolerances to keep within the streets. Options There are two options for you to pursue wafer dicing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premises. Secondly, Loadpoint offers a dicing solutions and processing service whereby you send us your material and specifications and we will dice and return the work for you. Loadpoint dicing solutions Loadpoint dicing solutions facility for dicing, cutting, drilling, grinding and prototyping
