By SELA
SELA offers sample preparation services for Physical Failure Analysis utilizing award winning state of the art technologies. Natural cleaving with high quality cross-section Cleaving accuracy down to 100 nm Edge cleaving- as close as 1mm (nominal) to wafer edge Edge cleaving- as close as 0.5mm (nominal) to sample edge Single die capability down to 2×1 mm size Dedicated preparations for special requirements Equipment: Award winning state of the art Nano Cleaving system MC600i, Smart Micro cleaving systems MC10, MC10i and MC20
