From silicon to cameras, Teledyne DALSA's manufacturing capabilities include: - CCD and CMOS wafer processing - Custom window attachment and sensor packaging for challenging environments - Backside thinning - Radiation tolerance - Fiber optic attachments - Extended environmental testing, including MIL-STD Example Completed Designs: Electron Detection TDI; DUV TDI; DUV Linescan, 1MHz Line Rate; High Volume TDI for FPD Inspection; 100 Million FPS, MIL-STD Compliant
