By AMT&C Group (Advanced Magnetic Technologies & Consulting Group)
SemiTeq offers high quality solutions for plasma chemical etching and deposition systems due to many years of experience in its development, production and maintenance. We also use the results of more than 15 years of our applications experience by customers to make SemiTEq’s solutions better Versatile configuration of serial models combined with cassette loading unit or cluster connection together with wide library of basic technologies allows us to offer optimal solutions for customers technological needs. Specially developed software implements modern technological processes without adding defects into the semiconductor structure. Etching ICP-RIE STE ICP200E Plasma chemical etching system in combined capacitive and inductive discharge (ICP-RIE) RIE STE RIE200 Reactive ion etching (RIE) system Technological processes - SiC deep plasma chemical etching to form metallization on the GaN transistor reverse side - GaAs deep plasma chemical etching to form metallization on the GaAs transistor reverse side - Si plasma chemical etching with high aspect ratio (Bosch-process) - Si plasma chemical etching low wall roughness - SiO2/Si plasma chemical etching with high selectivity - Si plasma chemical etching - Poly-Si high selectivity plasma chemical etching - Mo plasma chemical etching - InGaAs/AlGaAs plasma chemical etching - GaAs/AlGaAs plasma chemical etching for VCSEL - Si3N4 plasma chemical etching
