As per MIL-STD-883E, Method 2009.9, external visual inspection is primarily used to verify the workmanship of hermetically packaged devices. This method is used to inspect for damage due to handling, assembly, and/or test of the packaged device. As per MIL-STD-883E, Method 2012.7, the purpose of radiographic examination is to nondestructively detect defects within the sealed case, especially those resulting from the sealing process and internal defects such as foreign objects, improper interconnecting wires, and voids in the die attach material or in the glass when glass seals are used. It establishes methods, criteria, and standards for radiographic examination of semiconductor and hybrid devices. See the standard documentation for more information on test requirements, conditions, and procedures related to your application.
