By DB HiTek
The ShuttleChip (MPW: Multi Project Wafer) program allows customers to perform trial production of their semiconductor designs on a shared wafer, helping to verify the feasibility of commercial manufacturing. It reduces the cost burden for fabless companies and supports close collaboration between fabless and foundry partners across the entire semiconductor development process, from early-stage design and prototyping to mass production. 2026 ShuttleChip Schedule - Tape-out Start Date Process: Analog/BCD, BCD, Analog/BCD/SOI, Mixed Signal/RF HRS Process Detail: 0.18µm, 0.15µm, 0.13µm, 0.11µm Tech: AN07, AN180, HP180, BD180LV, BD180MV, BD180XH, BD180XA, VD180LV, BD180LVA, BD180LVB, AN180 Gen2, BD130, RS13 Fab: Fab1 or Fab2, Fab1, Fab2
