By Engent, Inc
Engent provides advanced surface mount technology (SMT) assembly services across a variety of electronic circuit applications. In modern electronic circuit manufacturing, SMT has become the ideal means of production. Advanced SMT extends the viability of printed surface boards, providing ideal size options while mounting on both sides of the circuit board. Due to an increasing demand for smaller, lighter, faster, more powerful, and more memory intensive packages, SMT will continue to serve a growing niche in the industry. Engent's SMT services provide a host of benefits for manufacturing and implementation, including: - Significantly increased manufacturing efficiency - Significantly decreased weight and size - Cost reduction for parts and handling - Reduced layer counts and holes drilled - Greater shock and vibration resistance - Noise reduction for greater package quality - Reduced power consumption and heat generation Our advanced surface mount technology assembly services include: - Flip chip - Direct chip attach and chip on board (COB) - 01005, 0201 through 55mm BGA processing - Adv. area array packages (FPBGA, CCGA, HBGA, double sided BGA, mirror BGA) - Chip scale package (CSP) assembly - 0.3mm-0.5mm wafer scale CSP (WLCSP) assembly - Lead-free solder - Optoelectronics assembly - Fiber splicing - High-density large panel assembly
