By Loadpoint
Applications Dicing of PZT and Piezo materials to produce sonar and ultrasound arrays, MEMs acutators, or multi-channel digital print heads. Process targets Optimising blade types and composition to produce accurate and repeatable kerfs (cut channels), process optimisation to ensure the highest productivity and lowest cost without sacrificing key objectives, protection of electronic contact layers during dicing. Options There are two options for you to pursue PZT and piezo materials dicing and processing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premises. Secondly, Loadpoint offer dicing solutions service whereby you send us your material and specifications and we will dice and return the work for you. Loadpoint dicing solutions Loadpoint dicing solutions facility for dicing, cutting, drilling, grinding and prototyping
