By Asia Pacific Microsystems Inc.
MEMS Express: Standard Process Platforms - Layout design comes from customer. - Fixed process (film stacking and thickness) but adjustable poly sheet resistance. - 1P2M and 2P2M with backside release - Large suspended diaphragm, over 1.0 mm 2 - Better efficiency with an additional black absorber layer - Cumulative Shipments: Over 14,000 wafers
