By Asia Pacific Microsystems Inc.
Capability | Wafer Size | Capability | Wafer Size | 150mm | 200mm | 150mm | 200mm Photolithography: - Coater (Track) - 200mm - Coater (Double side handling) - 150mm - Coater (Spray) - 150mm, 200mm - Developer (Track) - 150mm, 200mm - Developer (Double side handling) - 150mm - Stepper - 150mm - Aligner - 150mm, 200mm - Bonder - 150mm Dry Etching: - Si DRIE - 150mm - Polysilicon - 150mm - Dielectric - 150mm, 200mm - Metal - 150mm - Glass DRIE - 150mm, 200mm Wet Etching: - Wafer clean - 150mm - Si - 150mm - Silicon oxide - 150mm - Silicon nitride - 150mm - Metal - 150mm - Lift-off - 150mm, 200mm - PR strip - 150mm, 200mm Sputter: - Metal sputter - 150mm - Reactive sputter - 150mm Evaporator: - Metal - 150mm, 200mm Electroplating: - Cu plating - 150mm PECVD: - Amorphous silicon - 150mm - Silicon oxide - 150mm, 200mm - Silicon nitride - 150mm, 200mm - Silicon carbide - 150mm - PSG - 150mm - BPSG - 150mm Furnace: - Thermal oxidation - 150mm - Anneal - 150mm - Alloy - 150mm LPCVD: - Polysilicon - 150mm - Silicon nitride - 150mm Ion Implanter: - Medium current - 150mm - High current - 150mm Grinding: - Coarse grinding - 150mm - Fine grinding - 150mm - Ultra-fine grinding - 150mm Blade Dicing: - Silcion dicing - 150mm - Glass dicing - 150mm Laser Dicing: - Stealth laser dicing (silicon) - 150mm Pick&Place: - Pick&Place - 150mm WAT / CP test: - Prober - 150mm - Manual station - 150mm Metrology: - CD SEM - 150mm - Ellipsometer / Nanospec - 150mm - Stress meter - 150mm - Surface profiler - 150mm - 3D profiler - 150mm - IR microscope - 150mm - White-light interferometer - 150mm
