By Wintech Nano-Technology Services Pte. Ltd.
OBIRCH (or TIVA, OBIC, XIVA) scans the chip by controlling the focused infrared laser beam, which is coupled with a constant voltage and monitors the changes in current generated during laser scanning. High-energy laser penetrates multilayer metal and silicon substrate, from both front side and the back side analysis can save the traditional 1-2 days of analysis time. Silicon Si and III-VI chips can be positioned to meet the customer’s positioning of leakage short circuit location, transistor, capacitor, resistor short circuit, ESD, EOS short circuit positioning can be achieved.
