microfab´s Photolithography department is located in a class ISO 4 clean room cell. The processing of the following substrate sizes is possible: - 100mm / round - 150mm / round - 4 inch / round - 6 inch / round - 100mm / square - 4 inch / square Several Automatic Cluster Systems and semi-automated spin-coaters and developers for Lithography Processes are available. Various mask aligners for alignment & exposure are available. Backside alignment with ± 2 µm overlay accuracy is possible. The maximum resolution of 0.8 µm lines/spaces is achieved with thin positive resist. Thick positive resist, often used for microform applications, with thicknesses up to 100 µm, are also available. All layouts are on 5- or 7-inch chrome-on-glass masks. Furthermore, a direct-write photolithography machine is available with the following main key features: - 149mm x 149mm maximum writing area - 155mm x 155mm x 7mm maximum wafer size - 1µm and 5µm minimum feature sizes (depending on the configuration) across full writing area
