By Wintech Nano-Technology Services Pte. Ltd.
Project definition: manual operation by means of using hot plate or soldering iron heating to remove tin balls. Technical principle: removal of component from PCBA board by hot air gun blowing the whole area of BGA or using a soldering iron to melt the solder holding onto the component. Application advantages: the removed chip can be used for FA analysis, and can also be replanted with balls for crossover experiments.
