By DB HiTek
Global Power Device Leader Covers 50+ package types, 2600V power products compatible with SiC/GaN; 5.7 billion annual capacity, over 90% global market share for certain automotive devices.Advanced Packaging Expertise Master SiP, 2.5D/3D, WLCSP, PoP & Cu Pillar tech; 50,000+ copper pillars transferable in one batch.Automotive-Grade Reliability AEC-Q101/104 certified; laser wel ding & electromagnetic shielding processes; serves 40+ automotive clients, leading in EV controller market.Strong R&D Capacity 2024 R&D investment: ¥266 million (5.55 % of revenue); 15.2% R&D staff; 926 patents applied, 368 authorized.One-Stop Turnkey Service Full-process support from design to testing; PLM platform shortens clients' development cycles.Scalable Multi-Base Layout Synergy across Suzhou, Kunshan, Weihai, Shanghai; Guangzhou plant under construction to add 10.16 billion IC annual capacity.Top-Tier Customer Portfolio 10+ years of partnership with Infineon, Bosch, BYD, Wolfspeed; covers new energy vehicles, industrial control, photovoltaics and 5G.Customized Special Processes DSM, FCLGA, MEMS packaging available; tailored solutions for multi-die stacking, cavity structure, etc. Factories & Branches: Suzhou Kunshan Shanghai Weihai Melaka Supported Technologies: Wire Bond, Flip Chip, SiP, WLCSP, Bumping (Au), Bumping (Cu Pillar), Saw Filter LGA / WLCSP, FCBGA, FCCSP, BGA(MCU), Copper Clip, TOLT, TOLL, QDPAK, Power Module
