Achieve energy-efficient transmission at the speed of light with our silicon photonics process technologies that enable today’s pluggables and are ready for the ongoing transition of co-packaged optics (CPO). Fueling the future of electro-optical design with silicon photonics Built on a scalable, production-proven platform, our silicon photonics process technologies enable high-bandwidth, energy-efficient optical interconnects through tight integration of photonics, RF and advanced packaging to support evolving data center architectures and quantum computing. Supports all form factors Ranging pluggable optical transceivers, including coherent and long-haul optics, retimed and linear drive pluggable optics (LPO), near packaged optics (NPO) and co-packaged optics (CPO) Extreme design flexibility Supports custom, semi-custom and standard photonics flows, with the option for integration with our SiGe technology under one roof, enabling highly integrated designs optimized for both slow-and-wide and fast-and-narrow interface architectures OCI MSA-capable interconnect Our SCALE™ CPO solution for slow-and-wide, scale-out applications meets and exceeds the current Optical Compute Interconnect Multi-Source Agreement (OCI MSA) requirements Flexible fiber attach GF and ecosystem partner support for permanent, passive attach using undercut (v-grooves) and non-undercut solutions as well as detachable solutions, supporting broadband and high-power optical applications Global manufacturing We offer 300mm and 200mm manufacturing at scale across our Malta, New York and Singapore facilities, backed by in-house packaging and test resources Advanced packaging Solutions including TSVs, sub‑100 µm Cu pads, detachable fiber attach and support for advanced‑node EIC and on‑die lasers (in development), with U.S. onshoring planned at our Advanced Photonics & Packaging Center Malta, New York High-performance, scalable photonics solutions Our silicon photonics technologies deliver the performance, bandwidth scaling and energy efficiency required for today’s pluggables and next-generation CPO architectures. Proven to 200G/λ, clear path to 400G/λ Bandwidth upgrades optimized for demanding data center architectures and AI/ML clusters Turnkey design enablement Through our qualified platforms, PDKs, reference flows and a proven partner ecosystem – accelerating first-time-right design and volume production Demonstrated athermal CWDM filters With <1dB insertion loss, <0.2dB passband ripple and <-30dB crosstalk. Reliable, low-loss optical links with reduced signal degradation for low-latency, energy-efficient interconnects. Intrinsic EMI immunity helps minimize crosstalk and preserve signal integrity (*design dependent) 8/λ and 16/λ bi-directional DWDM We are the only 300mm silicon photonics foundry that has demonstrated 8λ and 16λ bi-directional DWDM natively on our platform, dWDM filters with 100-400GHz channel spacing are available
