Our advanced packaging services for compact, high-performance and energy-efficient systems integrate multiple technologies to enable new AI-driven architectures. As demand for compact, high-performance and energy-efficient solutions accelerates, advanced packaging becomes critical to enable next-generation systems as traditional scaling approaches reticle limits. Our advanced packaging solutions unify multiple process technologies into a single system, reducing interconnect distances and enabling new architectures across a range of applications. 2.5D & 3D integration: Advanced interposer technology enables high-density 3D integration (3DI), flexible wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding for heterogenous integration of logic, memory and power, with through-silicon vias (TSVs) available Integrate leading technologies: Supports W2W and D2W for industry and GF technologies, including our lauded CMOS, RF and silicon photonics platforms, for an integrated solution tailored to your application needs End-to-end integration: Delivers a continuous flow from wafer fabrication to assembly, packaging and test, with optimization, test coverage and full management to our production standards We combine advanced integration technologies, manufacturing expertise and design alignment to enable system-level packaging and production – supporting implementation from development through volume production. 3D heterogenous integration: Enables tight integration of multiple technologies and chiplets within a single package to support system-level functionality and performance scaling Homogenous integration: Our SLATE™ wafer-to-wafer bonding technology enables dense integration of similar die for improved interconnect efficiency and form factor scaling Manufacturing expertise: Delivered through our advanced packaging centers in the U.S. and Singapore, enabling secure, end-to-end packaging, assembly and test, all under one roof Design & integration support: Aligns packaging implementation with our technologies and manufacturing flows, supporting system-level integration from development through production Our advanced packaging services are structured to deliver a complete, end-to-end flow, supported by our dedicated advanced packaging centers, a globally distributed manufacturing footprint and trusted partners complementing our manufacturing for assembly, packaging and test, delivering a streamlined path to production.
