Achieve your next innovation by partnering with the GlobalSolutions™ ecosystem, our industry-leading, collaborative partner network that is designed to help you architect, optimize and validate your differentiated designs – on-time, first-time right. Our GlobalSolutions ecosystem is more than a partner network, it is a collaboration-driven ecosystem of expert partners designed to support differentiated design innovation, with end-to-end support across the design cycle. With 100+ global EDA, IP and design partners validated on GF technologies, our innovative ecosystem enables confident architecture selection, design optimization and validation – empowering first-time-right design decisions aligned to your performance, integration and application goals. Robust, silicon-proven IPs: Including cutting-edge IP providers for foundational, mixed-signal, interface and non-volatile memory devices, to inform architecture and accelerate integration Best-in-class EDA flows: Leading tools and proprietary flows, including silicon-to-systems design, simulation, implementation and validation flows for early insight into power, performance and reliability optimizations Design services: Comprehensive services for each step of the design cycle – including exploration, optimization and tapeout readiness – to streamline your path to production Our GlobalSolutions™ ecosystem combines global scale with proven impact. With a broad network of validated partners and a deep portfolio of silicon‑proven IP, the ecosystem has enabled hundreds of customers to architect, optimize and validate differentiated designs on GF technologies. 100+ ecosystem partners spanning IP, EDA, OSAT and design services 4500+ total IP titles across all nodes from >50 IP partners 300+ clients enabled by GlobalSolutions ecosystem partner IPs in the last 5 years 1700+ client designs enabled by GlobalSolutions ecosystem partners in the last 5 years End-to-end, customizable services: Our ecosystem supports each stage of the design cycle, from architecture and verification through implementation and readiness for packaging and test, enabling new designs, technology migration and field-programmable gate array (FPGA)-to-application-specific integrated circuit (ASIC) or chiplet programs, with flexibility to support both early-stage exploration and high-volume targets. First-time-right design confidence: Our GlobalSolutions ecosystem partners are deeply versed in our PDKs, validated IP and optimized EDA flows, providing early insight and rigor that empowers you to make first-pass design decisions with confidence that are aligned to your performance, reliability and ramp objectives. Application-optimized solutions: Choose from a global network of partners with demonstrated innovation expertise across the markets that we serve, ensuring alignment with your application-specific design requirements. Packaging & test solutions: Our solutions include thermal and electrical modeling, advanced 2.5/3D package design and production-ready qualifications for manufacturability and test readiness.
