Our portfolio of reliable, feature-rich CMOS solutions deliver a suite of application-driven capabilities optimized for cost-effective, long-lifecycle edge devices. Feature-rich solutions tailored to your application needs, backed by a global manufacturing footprint Built on advanced planar CMOS platforms, our portfolio balances performance, power and cost while enabling highly-integrated designs through rich embedded functionality. Supported by global manufacturing and options for regional expertise, we provide proven solutions that scale across a broad range of applications. Comprehensive solutions: 40+ distinct platforms spanning 10+ nodes from 22nm up to ≥180nm Feature-rich by design: Technologies supporting high-voltage, ultra-low leakage, ultra-low power, embedded non-volatile memory (eNVM) and analog compute-in-memory Designed for system integration: Advanced mixed-signal integration, feature-dense SoCs that reduce system complexity and optimize performance, area and cost Global to local manufacturing: High-volume manufacturing across the U.S., Germany, Singapore and through partners in China, trusted by more than 200 customers worldwide Design once, scale globally: One PDK, one GDS, multi-site qualification for manufacturing across facilities spanning the globe Technology porting: Validated PDKs and IP, robust design enablement and experience in technology porting in close partnership with customers Proven technologies, faster time-to-market Design your next breakthrough product with our feature-rich CMOS technologies, engineered for reliable, long-lifecycle designs with global manufacturing and robust design enablement. Serving 200+ customers worldwide: Trusted technology leadership for applications spanning automotive, industrial IoT and other high-growth markets Leading supplier to the #1 automotive MCU player in 2025: More than 2 million wafers shipped on 40nm technology, backed by Auto Grade 0 qualification and reliability eNVM solutions: Including embedded Flash (eFlash) and analog compute-in-memory Custom silicon offerings: Design your custom SoCs with processor IP from MIPS, a GlobalFoundries company Broad IP enablement: Extensive GF-owned and partner IPs, including analog mixed-signal, embedded memory and interface IPs Multi-source manufacturing: 40nm production at multiple GF sites, ensuring supply continuity and regional flexibility Your gateway to smarter, faster & more immersive experiences Choose the feature-rich CMOS process technology that best fits your sensing, compute or display application requirements. Sense Our sense technologies, including optical sensor options, enable low-noise, high-sensitivity imaging and sensing designs to power sensor and mixed-signal SoCs and ASICs. Our sense technologies are engineered for reliable signal acquisition across a wide range of sensor front ends – available from 22nm to 130nm nodes. - Our technologies enable consumer and automotive cameras with high-dynamic-range CMOS image sensors (CIS) and wafer-to-wafer bonding capability. - CMOS microphone and audio front-end ASICs deliver best-in-class signal-to-noise ratios (>75 dB) for high-performance voice, audio and sensor-fusion systems. - Front-side illuminated single photon avalanche diode (SPAD) optical sensor on GF’s 55nm platform enables direct time-of-flight (dToF) sensor SoCs for advanced depth-sensing. - Our technologies support diverse sensing applications spanning consumer, medical, industrial and automotive markets, including emerging edge AI use cases. Compute Our compute technologies support cost-optimized edge processing for scalable MCU with ultra-low power, ultra-low leakage and eNVM capabilities, spanning 22nm to 180nm nodes to address diverse performance, power and lifecycle requirements. - We enable applications across IoT, industrial, automotive, edge AI and secure connectivity, including automotive MCUs, secure MCUs, edge-connected devices and Bluetooth low energy microcontrollers – including with our newest 22UX and 40UX platforms. - Unique analog compute-in-memory capabilities on our 28SLPe-ESF3 technology support faster, more energy-efficient processing for AI workloads. Display Our feature-rich CMOS display solutions support a broad range of display driver and micro display backplane applications, enabling reliable operation, low leakage and consistent visual performance across markets – supported across 28nm, 40nm and 55nm nodes. - We are the first pure-play foundry to produce mobile OLED display driver ICs (DDICs) - Our 28nm high-voltage (HV) technology features the industry’s smallest SRAM bitcell. - Our portfolio of display solutions address applications from wearables to automotive environments. Serving diverse markets with feature-rich CMOS technologies Aerospace & defense: Supports mission-critical electronics using reliable, long-lifecycle technologies suited for secure processing and sensing applications – with radiation-resilient options available Automotive: Enables scalable automotive electronics through mixed-signal integration and automotive-grade options designed for extended product lifecycles across MCU, sensing and display applications Data center & communications infrastructure: Provides cost-effective mixed-signal platforms for networking interfaces and signal processing in infrastructure and edge environments Home & industrial IoT: Optimized for sensing, secure connectivity and efficient edge operation for industrial equipment and battery-powered IoT devices, including biometric sensors, medical and wearable devices Smart mobile devices: Supports compact subsystem solutions for imaging, display, audio and sensing to enable differentiated user experiences in space and power constrained designs Scale your designs with our trusted partner ecosystem Access our global partner ecosystem, with validated IP, EDA and design services expertise across our feature-rich CMOS technologies to accelerate development from concept to production.
