High electrical and thermal conductivity at manufacturing compatible processing conditions. A sintered interface is created in stages, and each stage has a particle-control consequence: - Powder and paste state: Primary size, agglomerate size, surface chemistry and solids loading set the starting packing density and organic-removal requirement. - Print or dispense: Rheology and the coarse particle tail affect stencil release, dispense stability and bondline consistency. - Drying and debinding: Volatile removal must avoid skinning, large voids and uncontrolled particle redistribution. - Sintering and neck growth: Clean, reactive particle surfaces are needed for neck formation and densification. Cu adds the need for oxide management. - Joint microstructure: Residual porosity, interface contact and grain connectivity determine thermal resistance, electrical resistance and mechanical strength. Silver sintering is an established high-performance route. Copper sintering is technically attractive because of conductivity and cost, but oxidation and surface control remain major development challenges. AM has demonstrated controlled silver particle synthesis, while copper represents an additional development route for applications that benefit from its conductivity and cost profile. The particle chemistry, oxidation control and sintering window can be engineered around the target package and process. Build the particle and sintering window around the joint you need, then preserve the formation logic as material demand increases. - K1 · Particle and sinter window: For Ag, map synthesis conditions against particle size, morphology, surface state and early sinter performance. For Cu, first establish chemistry and oxidation-control feasibility. - K10 · Qualification material: Produce repeat lots for paste formulation, print/dispense trials, sinter optimisation and package reliability testing. - K100 · Production route: Increase output only after the qualified particle window and downstream process are established, maintaining the same continuous-flow logic. Bring your specification: Useful inputs include die size and metallisation, substrate finish, target bondline, print or dispense method, available pressure, peak temperature, atmosphere, thermal/electrical targets, reliability plan and current paste or powder limitation.
